Resin composition for permanent insulating film, permanent insulating film, multilayer printed circuit board, and manufacturing method thereof
A resin composition, insulating film technology, applied in the direction of multilayer circuit manufacturing, printed circuit manufacturing, printed circuit, etc., can solve the problem of undesired conductor circuit layer, hinder signal transmission maintainability, etc., and achieve excellent plating solution resistance , the effect of suppressing adverse effects
Active Publication Date: 2021-01-08
TAIYO HLDG CO LTD
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- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0005] When the entire through-hole is plated in this way, if there is a portion where the electrical connection between the conductor circuit layers is not desired, there is a concern that this portion will be plated with a conductive substance, thereby hindering the maintainability of signal transmission.
Method used
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Examples
Experimental program
Comparison scheme
Effect test
Embodiment 1～8、 comparative example 1～3
[0108] (Preparation of resin composition for permanent insulating film)
[0109] According to the following Table 1, each component was kneaded with the 3-roll mill, and the resin composition of Examples 1-8 and Comparative Examples 1-3 were obtained. The numbers in the table represent parts by mass.
[0110] [Table 1]
[0111]
[0112] *1 jER828 manufactured by Mitsubishi Chemical Corporation
[0113] *2 90% carbitol acetate solution of DEN438 manufactured by Dow Chemical Company
[0114] *3 60% carbitol acetate solution of HF-1M manufactured by Meiwa Kasei Co., Ltd.
[0115] *4 40% carbitol solution of Joncryl 678 molecular weight 8500 styrene-acrylic resin (acid value 215mg / gKOH) manufactured by BASF CORPORATION
[0116] *5 Luberon L-5 manufactured by DAIKIN INDUSTRIES, LTD. has an average particle size of 5 μm
[0117] *6 TF-9205 manufactured by 3M Japan Limited has an average particle size of 8 μm
[0118] *7 KMP-590 manufactured by Shin-Etsu Chemical Co., Ltd. w...
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Abstract
The present invention provides a resin composition for a permanent insulating film, which does not accumulate catalyst substances (seed crystals) on a plating resist, and in particular, can easily and accurately form a partial through hole divided into a through hole according to design. . A resin composition for a permanent insulating film, characterized in that it contains: a thermosetting resin, a resin filler, and a compound containing at least one selected from sulfur atoms and nitrogen atoms; and a multilayer printed circuit board, which is A multilayer printed circuit board in which conductive layers and insulating layers in a circuit pattern are alternately stacked, and through holes are used to conduct conduction between the conductive layers. layer and the insulating layer, and the insulating layer between the layers of any one, or both of the plating resist; and the plating portion formed in the exposed area other than the plating resist, and the plating resist consists of the aforementioned A cured product of the resin composition is formed.
Description
technical field [0001] The present invention relates to a resin composition for a permanent insulating film, a permanent insulating film (plating resist) formed from its cured product, a multilayer printed circuit board manufactured using the same, and a method for manufacturing the same, in particular to a part having a through hole. A multilayer printed circuit board with partially through-holes formed by dividing the through-holes by the plating resist. Background technique [0002] Generally, in a printed circuit board, a patterned conductor circuit for connecting components is formed on the surface or inner layer of the circuit board based on the circuit design, and electronic components are mounted on the surface with solder. In recent years, due to miniaturization of electronic devices such as mobile phones, portable electronic terminals, and computers, densification of printed circuit boards used in these electronic devices has been demanded. [0003] On the other h...
Claims
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IPC IPC(8): H05K3/18H05K3/46
CPCH05K1/0373H05K3/184H05K3/4602H05K2201/0212H05K2201/0236H05K3/429H05K3/46H05K1/0298H05K1/0353H05K1/115H05K3/0047
Inventor 椎名桃子峰岸昌司
Owner TAIYO HLDG CO LTD