Eutectic soldering nozzle for realizing ultra-fine spacing between SMT devices in microwave tubes

Abstract

The invention relates to a eutectic welding suction nozzle for achieving ultra fine spacing between patch devices in a microwave transistor case. The eutectic welding suction nozzle comprises a suction nozzle rod and a channel arranged in the suction nozzle rod in the axial direction, the suction nozzle rod comprises a suction nozzle rod body and a suction nozzle head, the bottom of the suction nozzle head is provided with a groove, the channel is communicated with the groove, the groove comprises a top wall, a first side wall and two oppositely arranged second side walls, and the first side wall and the second side walls are arranged in an outwards inclined mode. According to the eutectic welding suction nozzle, the wide side edge and two long side edges of each device are clamped through the first side wall and the two second side walls of the groove respectively, and one device cannot slide in the other three directions in the eutectic scrubbing process but can only slide in the direction close to the adjacent device, so that it is guaranteed that spacing between the adjacent devices is smaller than 20 micrometers all the time, ultra fine spacing is achieved, and a good solution is provided for high integration and miniaturization of microwave power transistors.

Description

technical field [0001] The invention relates to the technical field of eutectic patching in microwave tube shells, in particular to a eutectic welding suction nozzle for realizing ultra-fine spacing between patch devices in microwave tube shells. Background technique [0002] Microwave power tubes are widely used in communication systems and radar systems. At present, the packaging of microwave shells is developing towards high integration and miniaturization, which requires more devices to be integrated in small shells. Therefore, the ultra-fine spacing between devices, which is less than 20 μm, is the current microwave A major technical problem in the field of power tube packaging. [0003] At present, the commonly used nozzles are four-sided card nozzles or two-side card nozzles. The distance between devices is always greater than 100 μm due to the thickness of the four-sided card nozzles; It seems to be able to ensure the realization of ultra-fine spacing between devic...

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Problems solved by technology

[0003] At present, the commonly used nozzles are four-sided card nozzles or two-side card nozzles. The distance between devices is always greater than 100 μm due to the thickness of the four-sided card nozzles; It seems to be able to ensure the realization of ultra-fine spacing between devices, but in the actual operation process, due to its eutectic friction will inevitably cause the device to slide in the empty area at both ends of the suction nozzle, so the suction nozzles on both sides cannot guarantee the spacing between devices Always less than 20μm

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