Cutting method of glass substrate
A glass substrate and cutting method technology, which is applied in the field of liquid crystal display processing, can solve the problems of high cost, high cost of high-performance cutter wheels, cracked sealant, etc., and achieves the effect of shortening the cutting process and reducing the cutting cost.
Active Publication Date: 2019-04-02
WUHAN CHINA STAR OPTOELECTRONICS TECH CO LTD
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Problems solved by technology
[0003] However, the traditional cutting method usually requires a high-performance cutter wheel to cut multiple times on the glass substrate, the process involved is complicated and the cost of the high-performance cutter wheel is high
In addition, countless small cracks are often generated on the cutting surface. If the stress is concentrated on these micro cracks, etc., it will cause abnormalities such as cracks and frame glue breakage.
Therefore, the traditional cutting method has high cost and low yield
Method used
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[0024] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0025] In addition, the following descriptions of the various embodiments refer to the attached drawings to illustrate specific embodiments in which the present invention can be implemented. The directional terms mentioned in the present invention, for example, "upper", "lower", "front", "rear", "left", "right", "inner", "outer", "side", etc., only is to refer to the direction of the attached drawings. Therefore, the direction terms used are for ...
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Abstract
The invention provides a method of cutting a glass substrate, comprising the steps of providing a mask that is provided with a cavity; filling the cavity with a cutting fluid; abutting the cavity side of the mask to the surface of a glass substrate, and attaching the cutting fluid to the surface of the glass substrate for erosion cutting. By filling the cavity of the mask with the cutting fluid and attaching the mask to the surface of the glass substrate, the cutting fluid in the cavity is attached to the surface of the glass substrate for erosion cutting of the glass substrate; through the method, it is possible to finish multiple cutting of multiple glass substrates in one step, such that the cutting process of the glass substrate is shortened and cutting cost is reduced.
Description
technical field [0001] The invention relates to the field of liquid crystal display processing, in particular to a cutting method of a glass substrate. Background technique [0002] In recent years, among electronic devices such as smartphones, tablet-type terminals, car navigation devices, and the like, a large number of touch panel-mounted products are sold. Generally, a touch panel is constructed by bonding a cover glass and an electrostatic sensor. The cover glass is cut from a glass substrate. Usually, one glass substrate can be cut into multiple pieces of cover glass by cutting with a wheelcutter or laser. [0003] However, the traditional cutting method usually requires a high-performance cutter wheel to cut multiple times on the glass substrate, the process involved is complicated and the cost of the high-performance cutter wheel is high. In addition, numerous fine cracks are often formed on the cutting surface, and if the stress concentrates on these micro cracks...
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IPC IPC(8): C03C15/00
CPCC03C15/00
Inventor 赵凯祥张俊骁
Owner WUHAN CHINA STAR OPTOELECTRONICS TECH CO LTD