Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Method and device for measuring structural data of medium and copper foil in printed circuit board

A technology for printed circuit boards and structural data, applied in the direction of measuring devices, instruments, etc., can solve the problems of long time, PCB board damage, and complicated process, so as to reduce the measurement time, reduce the cutting process, and improve the measurement efficiency.

Inactive Publication Date: 2018-12-25
ZHENGZHOU YUNHAI INFORMATION TECH CO LTD
View PDF6 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The above-mentioned existing method for measuring the structural data of the medium and copper foil in the PCB board is cumbersome, not only takes a long time but also requires a high cost, and the use of a slicing process to obtain PCB samples from the PCB board will cause damage to the PCB board. Destruction, once sliced, it will not be possible to use this PCB board for repeated measurement of electrical parameters on the board

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method and device for measuring structural data of medium and copper foil in printed circuit board
  • Method and device for measuring structural data of medium and copper foil in printed circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0034] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiment of the application will be clearly and completely described below in conjunction with the accompanying drawings in the embodiment of the application. Obviously, the described embodiment is only It is a part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

[0035] The terms "first", "second", "third", "fourth", etc. (if any) in the specification and claims of this application and the above drawings are used to distinguish similar objects, and not necessarily Used to describe a specific sequence or sequence. It is to be understood that the data so used are interchangeable under appropriate circumstances such that the ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The embodiment of the invention discloses a method for measuring the structural data of a medium and a copper foil in a printed circuit board. Based on a PCB board with copper leakage at the edge of the board, measuring of the data structure of the medium and the copper foil in the PCB board can be realized. The method includes the steps that firstly, the physical structure of a to-be-measured area in the PCB board is copied to the edge of the PCB board, and copper leakage occurs at the edge of the PCB board; then, a treatment procedure before measuring is adopted to pretreat the PCB board edge of the physical structure of the to-be-measured area in a replica board; and then, by measuring the physical structure data of the PCB board edge after pretreatment, the structural data of the medium and the copper foil of the to-be-measured area in the PCB board are obtained. Thus, on the premise of not destroying the structure of the PCB board, the structural data of the medium and the copperfoil in the PCB board are measured, and reuse of test samples can be ensured; and in addition, compared with the prior art, the method reduces the cutting process, greatly reduces the measurement timeconsumed in the measurement process, and improves the measurement efficiency.

Description

technical field [0001] The present application relates to the technical field of storage system hardware design, in particular to a method and device for measuring structural data of medium and copper foil in a printed circuit board. Background technique [0002] In the storage system, the hardware system, as the physical support of the entire system, plays a vital role in the stability and reliability of the system operation. In the entire hardware system, the printed circuit board (PCB), as the physical bearing and interconnection channel of most electronic devices, plays an extremely critical role in the hardware system. [0003] Prepreg (Prepreg, PP) and Core chip are the material components of the PCB board, and their electrical characteristics and thermal stability directly determine the working performance of the PCB board. In the process of manufacturing PCB boards, due to the existence of tolerances in the processing process, the structural data of the dielectric a...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G01B21/08G01B21/02
CPCG01B21/02G01B21/08
Inventor 陈兵
Owner ZHENGZHOU YUNHAI INFORMATION TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com