A wafer automatic slice loader
A loader and wafer technology, applied to conveyor objects, transportation and packaging, electrical components, etc., can solve problems such as low labor efficiency, wafer misplacement, product loss, etc., to reduce the risk of loss , The effect of reducing work intensity and improving work efficiency
Active Publication Date: 2019-01-15
GRINM SEMICONDUCTOR MATERIALS CO LTD
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- Abstract
- Description
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Problems solved by technology
In the factory, the separation and the work of the wafer loader are usually done manually by the operator. The manual operation is inefficient, and the wafer is often placed in the wrong slot.
Such manual operation can easily cause wafer breakage and product loss
Method used
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Embodiment Construction
[0015] The present invention will be further described below in conjunction with the accompanying drawings, but it does not mean limiting the protection scope of the present invention.
[0016] Such as figure 1 , 2 As shown, the wafer automatic slicing loader includes a loading table 1 , a slicing mechanism 2 , a transmission mechanism 3 , a slide ramp 4 , a carrier lifting mechanism 5 , and a wafer carrier storage tank 6 .
[0017] Wherein the feeding table 1 is located above the starting end of the conveying mechanism 3 , the slicer mechanism 2 is located above the middle of the conveying mechanism 3 , and the slide ramp 4 is located at the end of the conveying mechanism 3 , connecting the conveying mechanism 3 and the carrier elevating mechanism 5 . Slicing mechanism 2 comprises a driving wheel 7 and two driven wheels 8,9, driving wheel 7 is driven by a motor; driving wheel 7 and two driven wheels 8,9 are connected by a timing belt 10. The transmission mechanism 3 include...
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The invention discloses an automatic wafer separating and loading machine comprising a feeding platform, a separating mechanism, a transmitting mechanism, a sliding slope, a carrier lifting mechanism, and a wafer carrier storage water tank. The feeding platform is disposed above the starting end of the transmitting mechanism, the separating mechanism is disposed above the middle of the transmitting mechanism, and the upper end of the sliding slope is connected with the transmitting mechanism and the lower end is connected with the carrier lifting mechanism. The separating mechanism includes a driving wheel and two driven wheels, and the driving wheel and the two driven wheels are connected by a synchronous belt. The transmitting mechanism includes a driving wheel and two driven wheels, and the driving wheel and the two driven wheels are connected by two synchronous belts. There is a narrow gap between the synchronous belts of the transmitting mechanism and the discharge port of the feeding platform. The body of the carrier lifting mechanism includes a support screw, a servo motor, and a carrier placing platform, and the servo motor drives the support screw to support the carrier placing platform. The lower end of the sliding slope is aligned with a carrier slot. Thus, equipment can separate wafers and load wafers in a wafer carrier automatically, manual operation is reduced, and the work efficiency is improved.
Description
technical field [0001] The invention relates to an automatic wafer slice loader, which belongs to the technical field of semiconductor material wafer manufacturing equipment. Background technique [0002] In the semiconductor wafer manufacturing process, some processing procedures, such as single crystal wire cutting and wafer grinding, need to separate stacked wafers one by one, load them into wafer carriers, and transfer them to other processes. In the factory, the separation and the work of the wafer carrier are usually done manually by the operator. The manual operation is inefficient, and the wafer is often placed in the wrong slot. Such manual operation can easily cause wafer breakage and product loss. Contents of the invention [0003] The object of the present invention is to provide an automatic wafer slice loading machine to realize automatic equipment slice and automatic loading into wafer carriers, reduce manual operations, improve work efficiency, and reduce ...
Claims
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IPC IPC(8): H01L21/677
CPCH01L21/67778
Inventor 边永智宁永铎李兆进刘建涛张亮
Owner GRINM SEMICONDUCTOR MATERIALS CO LTD