Copper foil with carrier, laminated body, printed wiring board, electronic device, and manufacturing method of printed wiring board
A technology of copper foil with carrier and printed wiring board, which is applied in the direction of printed circuit manufacturing, printed circuit, printed circuit, etc., can solve the problem of pinholes in extremely thin copper layers, and achieve the effect of suppressing the occurrence of pinholes
Active Publication Date: 2019-01-08
JX NIPPON MINING & METALS CORP
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Problems solved by technology
[0009] 【Problem to be solved by the invention】
However, such an ultra-thin copper foil with a carrier having a thickness of 0.9 μm or less has a part of the ultra-thin copper layer that is pulled away from the carrier when the carrier is peeled off due to its thinness, leaving the remaining ultra-thin copper. problems such as pinholes in the layer
Method used
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[0075]
[0076] The copper foil with a carrier of the present invention has a carrier, an intermediate layer, and an ultra-thin copper layer in this order. In addition, the intermediate layer and the ultra-thin copper layer can be provided on one or both sides of the carrier, and the ultra-thin copper layer on one side and the carrier on the other side or the ultra-thin copper layer on both sides can be subjected to surface treatment such as roughening treatment. The use method of copper foil with carrier itself is well known in the industry, for example, the surface of the ultra-thin copper layer is bonded to paper base phenol resin, paper base epoxy resin, synthetic fiber cloth base epoxy resin, glass cloth-paper Composite substrate epoxy resin, glass cloth-glass non-woven composite substrate epoxy resin and glass cloth substrate epoxy resin, polyester film, polyimide film, liquid crystal polymer, fluororesin and other insulating substrates or films After thermocompression...
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Abstract
The present invention relates to a copper foil with a carrier, a laminate, a printed wiring board, an electronic device, and a method for manufacturing a printed wiring board. Specifically, it provides a copper foil with a carrier whose thickness is less than 0.9 μm. The occurrence of pinholes that occur when the carrier is peeled is well suppressed. The copper foil with a carrier of the present invention has a carrier, an intermediate layer, and an ultra-thin copper layer in this order, and the thickness of the ultra-thin copper layer is 0.9 μm or less. The ultra-thin copper layer side of the carrier is measured with a laser microscope in accordance with JIS B0601-1994 The surface has an arithmetic mean roughness Ra of 0.3 μm or less, and a peel strength of 20 N / m or less when the carrier is peeled off by the 90° peeling method according to JIS C 6471 8.1.
Description
technical field [0001] The present invention relates to a copper foil with a carrier, a laminate, a printed wiring board, an electronic device, and a method for manufacturing a printed wiring board, and in particular to a super electrode with a carrier with an ultra-thin copper layer having a thickness of 0.9 μm or less A thin copper foil, a laminate, a printed wiring board, an electronic device, and a method for manufacturing a printed wiring board. Background technique [0002] Generally, a printed wiring board is manufactured by bonding an insulating substrate to copper foil to form a copper-clad laminate, and then etching a conductive pattern on the surface of the copper foil. With the increasing demand for miniaturization and high performance of electronic equipment in recent years, high-density mounting of mounted parts or high frequency of signals has progressed, and miniaturization of conductor patterns (fine pitch (fine pitch)) has been required for printed wiring b...
Claims
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IPC IPC(8): H05K1/02H05K3/02
CPCH05K1/02H05K3/025H05K2203/0152H05K3/205H05K3/4007H05K2201/0355H05K2201/0367H05K1/09B32B7/06B32B15/20B32B2311/24B32B15/08B32B2457/08
Inventor 三好良幸古曳伦也永浦友太
Owner JX NIPPON MINING & METALS CORP