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Laminating module and laminating machine

A laminating machine and laminating technology, applied in the manufacturing of printed circuits, electrical components, printed circuits, etc., can solve the problems of overlapping films, defective products, bending, etc., to achieve automation, improve production efficiency, and improve the effect of yield rate.

Active Publication Date: 2019-06-04
GUANGDONG SOWOTECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a film laminating module and a film laminating machine, aiming to solve the technical problems of the prior art that when laminating films on flexible printed boards, problems such as overlapping and bending of films are easy to occur, resulting in defective products

Method used

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  • Laminating module and laminating machine
  • Laminating module and laminating machine
  • Laminating module and laminating machine

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Embodiment Construction

[0048] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. Attached below by reference Figure 1-14 The described embodiments are exemplary and are intended to explain the present invention, but should not be construed as limiting the present invention.

[0049] In describing the present invention, it should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", The orientation or positional relationship indicated by "horizontal", "top", "bottom", "inner", "outer", etc. are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than Nothing indicating or implying that a referenced device o...

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PUM

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Abstract

The invention relates to the technical field of automation equipment and particularly relates to a film pasting module and a film pasting machine. The film pasting module is applied to the film pasting machine and a dry film is attached to a printed board, and the film pasting machine includes a frame, the film pasting module includes a mount arranged on the frame and a film pressing device arranged on the mount, the film pressing device includes a slide rack slidingly arranged on the mount, a film pressing roller arranged on the slide rack, a sliding driving source for driving the slide rack to slide in the mount to enable the film pressing roller to abut against the surface of the printed board, and a rotation driving source for driving the film pressing roller to rotate to attach the dry film to the surface of the printed board, and the rotation driving source is arranged on the slide rack. According to the invention, the printed board can be prevented from film pasting overlapping and bending caused by the self-bending of the printed board during the transportation when the printed board is compressed by the film pressing roller, and the film pasting module and the film pasting machine are suitable for flexible printed boards, thereby greatly improving the film pasting yield and production efficiency.

Description

technical field [0001] The invention relates to the technical field of automation equipment, in particular to a film sticking module and a film sticking machine. Background technique [0002] Printed circuit boards are important electronic components, supports for electronic components, and carriers for electrical connections of electronic components. Printed circuit boards have developed from single-layer to double-sided, multi-layer and flexible, and still maintain their respective The development trend, due to the continuous development in the direction of high precision, high density and high reliability, the continuous reduction in size, cost reduction and performance improvement, makes printed circuit boards still maintain a strong vitality in the development of electronic equipment in the future. Among them, the printed circuit board needs to be processed with dry film before exposure. When the device of the prior art applies dry film to the printed circuit board, it ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00
CPCH05K3/0044H05K2203/0195
Inventor 杨威
Owner GUANGDONG SOWOTECH CO LTD