Integrated circuit packaging body and manufacturing method thereof

Abstract

The invention relates to an integrated circuit packaging body and a manufacturing method thereof. The integrated circuit packaging body disclosed by the embodiment of the invention comprises a packaging substrate with a first surface and a second surface, a first chip arranged on the first surface of the packaging substrate, a first insulating shell for shielding the first surface of the packaging substrate and the first chip, a second chip arranged on the second surface of the packaging substrate, a wire frame arranged on the second surface of the packaging substrate and a second insulating shell, wherein a plurality of internal pins are arranged on the second surface; the first chip and the second chip are arranged seperately to be electrically connected with the corresponding pins in the plurality of internal pins; the wire frame is arranged to be electrically connected with the plurality of internal pins; and the second insulating shell at least shields the second surface of the packaging substrate, the second chip and the wire frame. According to the integrated circuit packaging body, the technical problems of drop or collapse of solder balls, thermal deformation of the packaging substrate and the like in the prior art can be solved.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to an integrated circuit package in the technical field of semiconductors and a manufacturing method thereof. Background technique [0002] In existing integrated circuit packages, for double-sided module packaging using a packaging substrate, solder balls, conductive pillars, stud bumps, and stacked bumps are usually used to form external The pins or internal pins are electrically connected to the packaging substrate, and serve as the external signal transmission end of the integrated circuit package. However, the above-mentioned pin structure has the following defects when applied: [0003] First of all, during reflow (reflow) bonding, the raised solder balls or bumps are prone to fall off or collapse, resulting in problems such as lack of balls or inconsistent ball heights in the integrated circuit package. Therefore, the use of solder balls The integrated circuit packag...

AI Technical Summary

Problems solved by technology

[0006] One of the objectives of the present invention is to provide an integrated circuit package and its manufacturing method, which can solve the technical problems in the prior art such as solder ball falling off or collapse, thermal deformation of the package substrate, etc.

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