Manufacturing system and method of integrated circuit packaging structure

Abstract

The invention relates to a manufacturing system and method of an integrated circuit packaging structure, the manufacturing system comprises a bearing base, a conveying mechanism, a slide holder, a 3D printer, a non-contact thermodetector and a packaging machine, the conveying mechanism is connected with the bearing base and the upper end face, the rear end face of the conveying mechanism is communicated with the packaging machine, the slide holder is embedded in the conveying mechanism, and the 3D printer is connected with the non-contact thermodetector. The 3D printer wraps the conveying mechanism, one non-contact thermodetector is connected with the 3D printer, the other non-contact thermodetector is connected with the packaging machine, and the driving circuit is connected with the outer side face of the bearing base. The using method comprises the three steps of metal substrate presetting, first chip positioning and second chip positioning. According to the invention, the dependence on special equipment is reduced, the packaging flexibility is enhanced, and the quality, the reliability and the qualified rate of products are improved; and on the other hand, high cost caused by repeated processing is avoided, and the method is easily combined with the existing manufacturing process.

Description

technical field [0001] The invention relates to a manufacturing system and method for an integrated circuit packaging structure, belonging to the field of chip processing equipment and technology. Background technique [0002] In existing integrated circuit packages, for double-sided module packaging using a packaging substrate, solder balls, conductive pillars, stud bumps, and stacked bumps are usually used to form external The pins or internal pins are electrically connected to the packaging substrate, and serve as the external signal transmission end of the integrated circuit package. [0003] The existing solution is a metal substrate with grooves, figure 1 Area 1 is the bottom of the groove where the chip is fixed, and the depth and width of the groove are greater than the height and width of the chip respectively; Area 2 is the hub that connects the chip with the outside world through coupling, and the groove is filled with encapsulant, completely Cover the chip and ...

AI Technical Summary

Problems solved by technology

[0004] First of all, when the chip to be packaged is a high-power chip, such as a power amplifier chip, this type of integrated circuit package is prone to generate a lot of heat during use, and the above-mentioned pins represented by solder balls have a small contact area with the package substrate. , can not provide good heat dissipation, it is easy to cause high-power chips to burn due to overheating, and, due to the particularity of the package, professional equipment is required to produce these specific products; secondly, during the reflow (reflow) bonding period, the raised Solder balls or bumps are prone to falling off or collapsing, resulting in lack of balls or inconsistent ball heights in the integrated circuit package. Low defects; at the same time, due to the limitation of the size of its own electronic devices, it often leads to the inability to integrate multiple chips in a limited space. extremely inconvenient

Images