Unlock instant, AI-driven research and patent intelligence for your innovation.

Integrated circuit package and manufacturing method thereof

A technology of integrated circuits and manufacturing methods, which is applied in the direction of circuits, electrical solid devices, electrical components, etc., can solve the problems of thermal deformation of packaging substrates, solder balls falling off, and collapse, so as to improve quality and prevent solder balls from falling off or collapsing.

Active Publication Date: 2021-03-09
SUZHOU ASEN SEMICON CO LTD +1
View PDF9 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] One of the objectives of the present invention is to provide an integrated circuit package and its manufacturing method, which can solve the technical problems in the prior art such as solder ball falling off or collapse, thermal deformation of the package substrate, etc.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Integrated circuit package and manufacturing method thereof
  • Integrated circuit package and manufacturing method thereof
  • Integrated circuit package and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0013] In order to better understand the spirit of the present invention, it will be further described below in conjunction with some preferred embodiments of the present invention.

[0014] figure 1 is a schematic longitudinal cross-sectional view of an integrated circuit package 10 according to an embodiment of the present invention.

[0015] Such as figure 1 As shown, an integrated circuit package 10 according to an embodiment of the present invention includes a packaging substrate 11 , a first chip 13 , a first insulating case 14 , a second chip 15 , a lead frame 16 and a second insulating case 17 . Wherein, the packaging substrate 11 has a first surface 110 and a second surface 111 , and a plurality of internal pins 12 are disposed on the second surface 111 . The first chip 13 and the second chip 15 can be high-power chips, wherein the first chip 13 is disposed on the first surface 110 of the packaging substrate 11, and the second chip 15 is disposed on the second surfa...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to an integrated circuit package and a manufacturing method thereof. An integrated circuit package according to an embodiment of the present invention includes: a packaging substrate having a first surface and a second surface, wherein a plurality of internal pins are provided on the second surface; a first chip disposed on the first surface of the packaging substrate ; shielding the first surface of the packaging substrate and the first insulating shell of the first chip; the second chip disposed on the second surface of the packaging substrate, wherein the first chip and the second chip are respectively configured to connect with a plurality of internal pins Corresponding ones of them are electrically connected; a lead frame disposed on the second surface of the package substrate and configured to be electrically connected to each of the plurality of internal pins; and shielding at least the second surface of the package substrate, the second chip, and The second insulating housing of the lead frame. The embodiments of the present invention can solve technical problems in the prior art such as solder ball falling off or collapsing, thermal deformation of the packaging substrate, and the like.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to an integrated circuit package in the technical field of semiconductors and a manufacturing method thereof. Background technique [0002] In existing integrated circuit packages, for double-sided module packaging using a packaging substrate, solder balls, conductive pillars, stud bumps, and stacked bumps are usually used to form external The pins or internal pins are electrically connected to the packaging substrate, and serve as the external signal transmission end of the integrated circuit package. However, the above-mentioned pin structure has the following defects when applied: [0003] First of all, during reflow (reflow) bonding, the raised solder balls or bumps are prone to fall off or collapse, resulting in problems such as lack of balls or inconsistent ball heights in the integrated circuit package. Therefore, the use of solder balls The integrated circuit packag...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/488H01L23/495H01L23/31H01L25/07
CPCH01L23/3114H01L23/488H01L23/495H01L25/07H01L2224/16225H01L2224/32225H01L2224/48091H01L2224/48227H01L2224/73253H01L2224/73265H01L2224/97H01L2924/181H01L2924/19105H01L2924/3025H01L2924/3511H01L2924/00014H01L2924/00012H01L2924/00H01L2224/85H01L2224/81H01L2224/83
Inventor 李威弦吴云燚李菘茂
Owner SUZHOU ASEN SEMICON CO LTD