Microscopic Pore Sealant for Precious Metal Surface Treatment of Printed Circuit Boards
A printed circuit board and microscopic pore technology, which is applied in the field of water-based pore sealant, can solve problems such as lattice defects and PCB pad failure of printed circuit boards, and achieve improved soldering performance, good water solubility, and technological process simple effect
Active Publication Date: 2018-08-10
SHENZHEN BEIJIA ELECTRONICS MATERIAL
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Problems solved by technology
[0004] The precious metal layers of printed circuit boards, such as palladium, ruthenium, gold, etc., are stable in electrolyte or neutral salt spray, have strong corrosion resistance, and will not be corroded, but in the actual application process, The thickness of the precious metal layer on the final surface treatment of printed circuit boards is between 0.025-0.3 μm, so whether it is deposited by electroless plating or electroplating, there are inevitably some lattice defects, and corrosive substances can pass through These grain boundary gaps corrode the nickel layer and copper layer under the precious metal, which leads to the failure of the PCB pad of the printed circuit board
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[0015] The present invention will be further described in detail below in conjunction with five preferred embodiments presented in Table 1.
[0016] Wherein preferred embodiment one comprises the following components, by mass percentage, pentaerythritol 1.0%, substituted benzimidazole is 2-aminobenzimidazole, its mass percentage is 1.0%, polyaspartic acid 1.0%, isopropanol 2.0%, and the rest is deionized water. After cleaning and washing the PCB workpiece coated with the precious metal layer, soak or spray it in the bath liquid of the first component of the preferred embodiment of the preferred embodiment at 25°C for 3 minutes, that is, 180 seconds, and then wash and dry it with running water to form a precious metal layer Good pore sealing effect.
[0017] Wherein preferred embodiment 2 comprises the following components, by mass percentage, pentaerythritol 4.5%, substituted benzimidazole is 2-dimethylaminobenzimidazole, its mass percentage is 2.7%, polyaspartic acid 0.3%, i...
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Abstract
A micro pore sealing agent for noble metal surface treatment of a printed circuit board comprises the following components by the weight percentage: 0.1-5.0% of pentaerythritol, 0.1-3.0% of substituted benzimidazole, 0.1-5.0% of polyaspartic acid, 0.1-5.0% of low-molecular-weight alcohol, and the balance deionized water. The printed circuit board is soaked in a 25-60 DEG C sealing agent bath liquid for 40-300 seconds or sprinkled by the 25-60 DEG C sealing agent bath liquid for 40-300 seconds, the noble metal surface can be well cleaned and micro pore sealing is formed; especially, the sealing agent has good cleaning effect and excellent micro pore sealing effect on palladium, ruthenium, gold and other noble metal layers, and not only ensures corrosion resistance of the printed circuit board but also meets quality requirements of welding spots after welding.
Description
【Technical field】 [0001] The invention relates to an aqueous pore sealing agent, in particular to an aqueous pore sealing agent for sealing pores on the surface of precious metals, in particular to a pore sealing agent for surface treatment of precious metals on printed circuit boards in the electronic assembly industry. 【Background technique】 [0002] In the circuit board manufacturing industry, in order to maintain the solderability of the pads in the printed circuit board, that is, PCB manufacturing to the welding of electronic components, and to maintain the electronic and electrical properties during the final service life of electronic products, PCB surface treatment is indispensable. part of the Among them, one of the main methods is the process of using precious metals as the final surface treatment layer of the pad, including: electroless nickel immersion gold (ENIG), electrolytic nickel gold (Electrolytic Ni / Au), electroless nickel palladium immersion gold (ENEPIG)...
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IPC IPC(8): C25D5/48
CPCC25D5/48
Inventor 李荣黎坊贤王予
Owner SHENZHEN BEIJIA ELECTRONICS MATERIAL