The method of laminating the printed board
A printed board and film sticking technology, which is applied in the field of film sticking, can solve problems such as film overlapping, product defects, and bending, and achieve the effects of improving production efficiency, strong practicability, and improving yield
Active Publication Date: 2019-05-03
GUANGDONG SOWOTECH CO LTD
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Problems solved by technology
[0003] The purpose of the present invention is to provide a method for attaching a film to a printed board, which aims to solve the technical problems of the prior art that easily cause problems such as overlapping and bending of the film when attaching a film to a flexible printed board, resulting in defective products
Method used
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[0057] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. Attached below by reference Figure 1-14 The described embodiments are exemplary and are intended to explain the present invention, but should not be construed as limiting the present invention.
[0058] In describing the present invention, it should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", The orientations or positional relationships indicated by "horizontal", "top", "bottom", "inner", "outer", etc. are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than Nothing indicating or implying that a referenced devi...
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The invention relates to the film pasting technology field and especially relates to a film pasting method of a printed board. The method is used for pasting a dry film on the printed board. The method comprises the following steps of providing a front conveying segment and conveying the printed board which needs film pasting to an assigned position through the conveying segment; pasting the dry film on a printed board surface in advance; providing a pressed-film roller, driving the pressed-film roller to move towards a direction of the printed board which is pasted with the dry film in advance till that the pressed-film roller abuts against the dry film; driving the printed board to move forwardly through the front conveying segment continuously and simultaneously driving the pressed-film roller to rotate so that the dry film is pasted on the printed board surface; and providing a rear conveying segment, conveying the printed board which is about to complete dry film pasting to a next assigned position through the rear conveying segment, and simultaneously, driving the pressed-film roller to reset. In the invention, when the pressed-film roller presses the printed board tightly, adverse conditions of film pasting overlapping, bending and the like caused by self-bending of the printed board during a conveying process can be ensured to be avoided; the method is especially suitable for film pasting aiming at a flexible printed board; and a yield of flexible printed board film pasting is greatly increased.
Description
technical field [0001] The invention relates to the technical field of film sticking, in particular to a film sticking method for printed boards. Background technique [0002] Printed circuit boards are important electronic components, supports for electronic components, and carriers for electrical connections of electronic components. Printed circuit boards have developed from single-layer to double-sided, multi-layer and flexible, and still maintain their respective The development trend, due to the continuous development in the direction of high precision, high density and high reliability, the continuous reduction in size, cost reduction and performance improvement, makes printed circuit boards still maintain a strong vitality in the development of electronic equipment in the future. Among them, the printed circuit board needs to be processed with dry film before exposure. When the device of the prior art applies dry film to the printed circuit board, it generally moves ...
Claims
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IPC IPC(8): H05K3/28
CPCH05K3/28H05K2203/1383
Inventor 谢军杨威
Owner GUANGDONG SOWOTECH CO LTD