Trimming tool and front end shape forming method of cutting tool adopting trimming tool

Abstract

The invention provides a trimming tool and a front end shape forming method of a cutting tool adopting the trimming tool. The front end of the cutting tool is easily cut to be the expected shape. According to the forming method of the cutting tool, the trimming tool of the groove having an inverted shape of the expected shape is used to form the front end of the cutting tool to be in the expected shape. The forming method comprises steps that according to a maintaining step, a chuck workbench is used to absorb and hold the trimming tool; according to a forming step, the cutting tool rotates at a high speed, and then the cutting tool is clamped in the groove of the trimming tool held by the chuck work bench, and in addition, the cutting tool can move with respect to the trimming tool held by the chuck work bench, and therefore the front end shape of the cutting tool is in the expected shape.

Description

technical field [0001] The present invention relates to a dressing tool and a method for forming a tip shape of a cutting tool using the tool, and the tip shape of the cutting tool is formed into a desired shape. Background technique [0002] As a silicon wafer (hereinafter, sometimes simply referred to as a wafer) on which multiple devices such as ICs and LSIs are formed on the front surface, the back surface is ground and processed to a predetermined thickness. , is divided into individual device chips by a cutting device, and the divided device chips are widely used in various electronic devices such as mobile phones and computers. [0003] When dividing the wafer into individual device chips, the wafer is divided into individual device chips by cutting the wafer along planned dividing lines with a cutting blade mounted on the cutting device. [0004] In recent years, the cost reduction of electronic components has been demanded in the market. As one of the countermeasur...

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Problems solved by technology

[0005] Therefore, it is necessary to reduce the thickness of the cutting tool for cutting the wafer, but there is a problem that the strength of the tool decreases when the thickness is reduced, and the cutting tool is bent during the cutting process, resulting in damage to the cutting tool.

[0009] However, the cutting tool with a multilayer structure disclosed in Patent Document 1 has to be produced by manufacturing green sheets (grinders) having different properties, bonding and sintering these green sheets, which is poor in workability and has problems to be solved in terms of cost.

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