Substrate separation device and substrate separation method

Abstract

A substrate separation device and a substrate separation method are disclosed. The comprises a base and two blowing means respectively located on opposite sides of the base and each of the blowing means having at least two air outlets, and the two air outlets of each blowing means are arranged on the left-right manner with a gap inbetween and used to provide two air streams, of which the airflow directions are away from each other. The airflow directions of the two air streams of one blowing means are symmetrical or at least substantially symmetrical to the airflow directions of the two air streams of the other blowing means. The substrate separation device allows silicon wafer to be effectively separated and maintained at a certain floating height without tilting, thereby preventing silicon wafers from sticking togather.

Description

technical field [0001] The invention relates to a substrate separation device and a substrate separation method, in particular to a separation device and method for separating silicon wafer substrates. Background technique [0002] At present, in the production process of solar cells, when it is desired to load a piece of silicon wafer into the relevant process equipment for production processing, air is usually blown on both sides of the silicon wafer with the help of an air blowing device, so that the stacked silicon wafer The top piece is separated from the second piece, and then the uppermost silicon wafer is picked up by the robot arm, which can avoid the adhesion of the whole stack of silicon wafers due to static electricity or other factors, thereby preventing the second piece caused by adhesion. The first or even the third silicon wafer is brought up and the problems of flakes and cracks arise. [0003] However, the existing air blowing method is a counter-blowing m...

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Problems solved by technology

[0003] However, the existing air blowing method is a counter-blowing method in which the airflows on both sides are directly facing each other. This method tends to cause the blown airflows to cancel each other out and cause the problem that the silicon wafers cannot be separated smoothly.

Moreover, if the counter-blowing method with a single air flow on both sides is used, because the position of the air flow is corresponding to the center of the silicon wafer, it is easy to cause the silicon wafer that is blown and floated to tilt like a seesaw, which is also easy to cause Occurrence of sticking problems between silicon wafers

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