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Handset assembly technology

An assembly process and mobile phone technology, applied in telephone structure, telephone communication, electrical components, etc., can solve problems such as mic damage or loss, yield drop, welding slag accumulation in mobile phones, etc., to avoid mic damage or loss and improve assembly Craftsmanship, the effect of avoiding scratches

Inactive Publication Date: 2017-02-01
贵州晟益科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the size of the mic is very small, and the solder joints are not very firm. During the process of passing on the assembly line, it is easy to cause damage or loss of the mic, resulting in a decline in yield and affecting product quality.
[0005] In addition, in the prior art, there is generally no step of purging the motherboard and removing welding slag, which may cause welding slag to accumulate in the mobile phone and affect the quality of the product

Method used

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Embodiment Construction

[0025] The technical solutions of the present invention will be clearly and completely described below, and obviously, the described embodiments are part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0026] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" etc. The indicated orientation or positional relationship is only for the convenience of describing the present invention and simplifying the description, but does not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be construed as limiting the present invention . In add...

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Abstract

The invention relates to the technical field of assembly of electronic products, and in particular relates to a handset assembly technology. The technology comprises the following steps of firstly respectively assembling a bottom shell, a surface shell, and a mainboard part except a microphone, and assembling the assembled mainboard except the microphone with the bottom shell; then welding the microphone to the main board; and at last assembling the surface shell. According to the improved handset assembly technology provided by the invention, the step of welding the microphone is put at the last step before assembly of the surface shell, so that the problem that the microphone is damaged or lost when a semi-finished handset with the prematurely installed microphone is transmitted on an assembly line is avoided, and thus yield of the products is improved.

Description

technical field [0001] The invention relates to the technical field of electronic product assembly, in particular to a mobile phone assembly process. Background technique [0002] In recent years, with the rapid popularization of smartphones and tablet devices, the user base has increased rapidly. People are no longer satisfied with the basic functions of mobile phones, but have put forward higher requirements for their appearance and performance. [0003] In order to ensure production efficiency and quality, and to facilitate enterprise management, current electronic products are produced by subcontracting and assembly lines. Therefore, a reasonable assembly process can greatly improve production efficiency and ensure product quality. [0004] In the existing assembly process, generally, the mic (Mike) is welded to the motherboard first, and then the steps of welding the LED lamp, welding the horn, welding the Bluetooth antenna, welding the camera and welding the LCD scree...

Claims

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Application Information

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IPC IPC(8): H04M1/02
CPCH04M1/026
Inventor 陈添旭
Owner 贵州晟益科技有限公司
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