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Arc material box and using method thereof

A material box and arc-shaped technology, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve problems such as easy occurrence of different glue, and achieve the effect of ensuring different glue, uniform force, and good centrifugal effect

Active Publication Date: 2017-02-08
SHENZHEN SMIDA ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the limitations of the existing material box, it is impossible to separate the glue and phosphor powder of each LED lamp so that the phosphor powder sinks to the bottom, and the phenomenon of foreign glue is easy to appear during the processing.

Method used

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  • Arc material box and using method thereof
  • Arc material box and using method thereof
  • Arc material box and using method thereof

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Embodiment Construction

[0032] In order to express the present invention more clearly, the present invention will be further described below in conjunction with the accompanying drawings.

[0033] see Figure 1-5 , the arc-shaped material box provided by the present invention includes a box-shaped main body 1 in the middle, a plurality of LED brackets 2 and a plurality of arc-shaped partitions 3, and a plurality of It is used to fix the upper wall groove body 11 of the LED bracket 2, and the lower wall of the inner cavity of the box-shaped main body 1 is evenly provided with a plurality of lower wall groove bodies 12 corresponding to the upper wall groove body 11 one by one, and the LED bracket 2 through its two sides are respectively matched with the upper wall groove body 11 and the lower wall groove body 12 and fixed in the arc-shaped material box; every two adjacent upper wall groove bodies 11 are provided with upper wall convex 13, and every two adjacent lower wall grooves 12 are provided with ...

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Abstract

The invention discloses an arc material box and a using method thereof. The arc material box comprises a hollow box body. The upper wall of the inner cavity of the box body is provided with multiple upper wall groove bodies. The lower wall of the inner cavity of the box body is provided with multiple lower wall groove bodies. LED brackets are fixed into the arc material box through matching between the two sides thereof and the upper wall groove bodies and the lower wall groove bodies. An upper wall bump is arranged between every two adjacent upper wall groove bodies. A lower wall bump is arranged between every two adjacent lower wall groove bodies. After the upper wall bumps extend to the corresponding lower wall bumps, multiple arc partition boards with different radians and sizes are formed. One LED bracket is clamped between every two adjacent arc partition boards. The arc radius of each arc partition board is set according to the distance from the arc partition board to the center of rotation, so that the LED brackets clamped by the arc partition boards are stressed more uniformly, glue overflow is avoided in the centrifugal process, and LED phosphor all sinks to the bottom.

Description

technical field [0001] The invention relates to the field of mechanical processing, in particular to an arc-shaped material box and a using method thereof. Background technique [0002] In the batch processing of LED lights, it is usually necessary to fix multiple LED lights on the LED bracket, then fix the multiple LED brackets on the material box, then install the material box on the centrifugal equipment, and drive the material box through the centrifugal equipment Rotate, and then drive the LED bracket to rotate, realize the centrifugal movement of each LED lamp, and try to separate the glue and phosphor powder of each LED lamp to achieve the purpose of all the phosphor powder sinking to the bottom. However, due to the limitation of the existing material box, it is impossible to separate the glue and the fluorescent powder of each LED light so that the fluorescent powder completely sinks to the bottom, and the phenomenon of foreign glue is prone to occur during the proce...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/50
CPCH01L33/48H01L33/50
Inventor 沈从奎
Owner SHENZHEN SMIDA ELECTRONICS
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