A sealing structure and a semiconductor device

Abstract

The invention provides a sealing structure and a semiconductor device. The sealing structure is provided with a bracing ring and a flexible sealing ring closely attached thereto, wherein an inner ring of the bracing ring is inclined outwards relative to an outer ring of the bracing ring; the flexible sealing ring is arranged to be closely attached to the side, which is inclined outwards, of the bracing ring, and the flexible sealing ring is enabled to be attached to the bracing ring so as to also form an inner ring inclined outwards; a movable portion is formed at the end, which goes beyond the top portion of the inner ring of the bracing ring, of the top portion of the inner ring of the flexible sealing ring; and when a sealing object is inserted into the inner ring of the sealing ring, the sealing object moves from the side, which is inclined outwards, of the sealing ring to the sealing ring, the sealing object pushes the movable portion to rotate along with the moving direction of the sealing object by taking the top portion of the inner ring of the bracing portion as a fulcrum, and the side surface of the movable portion is enabled to be completely closely attached to the surface of the sealing object, and thus the sealing object is sealed.

Description

technical field [0001] The invention relates to the technical field of semiconductor equipment, in particular to a sealing structure and semiconductor equipment with the sealing structure. Background technique [0002] In semiconductor process equipment, to make the wafer enter the reaction chamber for processing, it is inevitable to open the wafer box door and transfer the wafer in it. During the wafer transfer process, the exposed area of ​​the wafer needs to be controlled to a minimum. While the exposed area is usually a fairly closed space, the lower oxygen content is packaged by filling the enclosure with nitrogen or other inert gas. This enclosed area is often referred to as a microenvironment. [0003] To ensure a low oxygen content in the microenvironment, each interface part of the equipment or the wafer transfer position needs to be well sealed and isolated. [0004] The wafer is transferred to the process chamber through the interface between the wafer cassette ...

AI Technical Summary

Problems solved by technology

The usual practice is to set a compressible gasket at the interface between the wafer box and the microenvironment, and to seal the wafer box and the microenvironment through the deformation generated by the compression of the gasket, but due to the compression of the gasket A certain amount of compression force is required to produce compression. If the compression force is not enough, the sealing performance will be poor, and the oxygen content control will not meet the equipment requirements.

However, if the pressing force is large, because the standard fixing method of the wafer box is fixed at the bottom, the reaction force generated by the pressing of the wafer box and the gasket will cause the wafer box to tilt back, which will also lead to poor sealing, and the wafer The backward position of the cassette will affect the position accuracy of the wafer in the wafer cassette, resulting in the failure of the wafer transmission and even the collision or scratch damage of the wafer and the transmission device

The industry is committed to completely solving this problem, and some of them use the top of the wafer box to press the wafer box or other locking devices to prevent the position accuracy of the wafer box from changing, but these mechanisms are complicated in structure, high in cost and low in reliability.

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