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Steam curing method and device for PC components

A technology for steam maintenance and components, applied in the field of construction, can solve the problems of large land occupation, high operating costs, large pollution, etc., and achieve the effects of high utilization rate of thermal energy, increased supply time, and convenient access to warehouses and warehouses.

Active Publication Date: 2018-12-04
湖南贵庭住宅工业集团有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Its disadvantages are: large investment, high energy consumption, large pollution, large land occupation, and high operating costs
In addition, during the maintenance process of PC components, heat will be generated inside, which will easily cause the internal structure to be too high and damage the internal structure, making its overall strength not meet the requirements, and the appearance is also prone to 3mm-1cm cracks, making the actual PC board Strength lower than design strength

Method used

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  • Steam curing method and device for PC components
  • Steam curing method and device for PC components
  • Steam curing method and device for PC components

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] refer to Figure 1-Figure 4 , a steam curing device for PC components, comprising a thermal insulation steam curing bin 1 and self-climbing transfer equipment, the thermal insulation steam curing bin 1 is provided with a humidifier 2, a temperature and humidity sensor 32 and a multi-layer steam curing kiln 3, and the steam curing The kilns 3 are connected to each other; the lower part and the top of the heat preservation and steaming warehouse 1 are connected through the pipeline 4, and the air pump 5 is arranged on the pipeline 4 to form a circulating air system; the bottom of the heat preservation and steaming warehouse 1 is provided with a pool 6, which is connected with solar energy Hot water engineering system, cold water pipe 33 and humidifier 2; described climbing type transfer equipment includes fixed support 17 and mobile support 18, the top both sides of mobile support 18 are connected with first roller 19, the bottom end of mobile support 18 is connected with ...

Embodiment 2

[0040]The PC component is finished on the PC component carrying plate 26, and then the PC component carrying plate 26 is pushed down on the feeding frame 23 by the second feeding roller 25, and the climbing transfer equipment sends the PC component carrying plate 26 to the corresponding position of the steam curing kiln 3. A feeding roller 24 sends the PC component bearing plate 26 into the steam curing kiln 3 to steam the PC components.

[0041] When the outside temperature is lower than 25°C, the solar hot water engineering system heats the thermal insulation steaming storage bin 1 to keep the curing temperature in the thermal insulation steaming storage bin 1 between 5-25°C, preferably 19°C-25°C; When the temperature is higher than 25°C, cold water is introduced through the cold water pipe 33, and the cold water is scattered into the warm steaming bin 1 to cool down through the humidifier 2, so that the curing temperature in the heat preservation steaming bin 1 is kept betwe...

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Abstract

The invention discloses a PC member steam curing method and device. A PC member is cured in the condition with temperature being 5-25 DEG C and humidity being more than 90%, and the device comprises a heat insulation steam-curing cabin and a self-climbing type transfer device. Humidifiers and multilayer steam-curing kilns are arranged in the heat insulation steam-curing cabin and the multilayer steam-curing kilns communicate with one another; the lower portion of the heat insulation steam-curing cabin communicates with the top portion of the heat insulation steam-curing cabin through pipelines, and the pipeline is provided with an air pump to form a circulating wind system; and a pool is arranged at the bottom of the heat insulation steam-curing cabin and communicates with a solar energy water heating engineering system. According to the PC member steam curing method and device, large-batch production can be achieved, the operations that the PC member enters and gets out from the heat insulation steam-curing cabin are synchronous with production line takt; solar energy is used, energy is saved, the constant temperature of the heat insulation steam-curing cabin is maintained from beginning to end, and a heat energy use ratio is high; a stacker crane is automatically controlled, and the operations that the PC member enters and gets out from the heat insulation steam-curing cabin are convenient; and heat loss is low, and the heat loss occurs only in door-open time.

Description

technical field [0001] The invention belongs to the technical field of construction, and in particular relates to a steam curing method and device for PC components. Background technique [0002] The curing of existing PC components is usually carried out at room temperature or in a curing kiln. At room temperature, it is easy to cause cracks in PC components during the curing process, and the curing time is long, which is a waste of time. Especially in winter, the low temperature makes it difficult for the concrete to condense or even Can not be condensed. Some curing parts are also carried out in curing kilns, which use coal or electricity to heat the air to keep the temperature stable, but this will lead to a decrease in air humidity, making PC components more prone to cracks. Moreover, if coal or electricity is used for heating, the condition is that dozens of hole curing kilns must be built, and there must be a heating system of more than 5 million kilojoules. Its dis...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B28B11/24C04B40/02
CPCB28B11/245B28B11/247C04B40/024C04B40/0263
Inventor 杨雪辉肖俊
Owner 湖南贵庭住宅工业集团有限公司
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