Edge flow elements for electroplating plants
An electroplating device, edge flow technology, used in electrical components, galvanic insulation devices, electrolytic components, etc.
Active Publication Date: 2019-07-09
LAM RES CORP
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In the face of these challenges, WLP applications must compete with traditional and potentially cheaper pick-and-place continuous routing operations
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[0103] One embodiment is an electroplating apparatus comprising: (a) an electroplating chamber configured to house an electrolyte and an anode when electroplating metal onto a substantially planar substrate; (b) a substrate holder configured To maintain a substantially flat substrate so that the plated surface of the substrate is separated from the anode during electroplating, wherein when the substrate is positioned on the substrate holder, the interface between the substrate and the substrate holder form a corner on the top defined by the plated surface of the substrate and on the sides by the substrate holder; (c) a channeled ion-resistive element comprising a substantially parallel substrate a plated side and a substrate-facing surface that is separated from the plated side of the substrate during electroplating, the channeled ion-resistive element comprising a plurality of non-communicating channels, wherein the non-communicating channels enable electrolyte transport throu...
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Abstract
The present invention relates to edge flow elements for electroplating apparatus, and more particularly to methods and apparatus for electroplating one or more materials onto a substrate. In many cases, the material is a metal and the substrate is a semiconductor wafer, but not limited thereto. In general, embodiments of the invention utilize a channeled plate positioned adjacent to a substrate, creating a lateral flow manifold defined at the bottom by the channeled plate, at the top by the substrate, and laterally by lateral flow confinement rings. Tube. An edge flow element configured to direct electrolyte into a corner formed between the substrate and the substrate holder is also typically provided. During electroplating, fluid passes upwardly through the channels in the channeled plate and laterally through a cross-flow side inlet located on one side of the cross-flow confinement ring into the cross-flow manifold. The flow paths are combined in a cross-flow manifold and exit at a cross-flow outlet opposite the cross-flow inlet. These combined flow paths and edge flow elements result in improved plating uniformity, especially at the periphery of the substrate.
Description
technical field [0001] Embodiments of the invention relate to methods and apparatus for controlling electrolyte fluid dynamics during electroplating. More specifically, the methods and apparatus described in this invention are particularly useful for plating metals on semiconductor wafer substrates, e.g., small micro-raised features (e.g., copper, nickel, tin, etc.) and tin alloy solder) and through resist plating of copper through-silicon via (TSV) features. Background technique [0002] Electrochemical deposition processes are well established in modern integrated circuit fabrication. The shift from aluminum to copper wire interconnects in the early 21st century has driven the need for increasingly complex plating processes and plating tools. Most complex processes have evolved in response to the need for smaller current-carrying lines in the device metallization layers. These copper lines are formed by electroplating metal into very narrow, high aspect ratio trenches a...
Claims
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IPC IPC(8): C25D7/12C25D17/00
CPCC25D7/12C25D17/001C25D5/08C25D17/008C25D17/06C25D17/02H01L21/2885
Inventor 加布里埃尔·海·格拉哈姆布莱恩·L·巴卡柳史蒂文·T·迈耶罗伯特·拉什詹姆斯·艾萨克·福特纳蔡李鹏
Owner LAM RES CORP