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Sandwich alignment pattern transfer process

A graphic transfer and sandwich technology, which is applied in the direction of photolithography, optics, instruments, etc. on the patterned surface, can solve problems such as misalignment between layers, and achieve the effects of improving production efficiency, increasing production profits, and eliminating procurement costs

Inactive Publication Date: 2017-03-22
昆山维嘉益材料科技有限公司
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Problems solved by technology

[0003] The technical problem mainly solved by the present invention is to provide a sandwich alignment pattern transfer process. Aiming at the problem that the existing alignment process easily causes interlayer misalignment and offset, the present invention adopts 4 to 6 butterfly cross target holes, which can realize High-precision sandwich alignment greatly improves production efficiency, while eliminating the purchase cost of alignment equipment and increasing production profits

Method used

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  • Sandwich alignment pattern transfer process

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Embodiment Construction

[0015] The following will clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0016] Such as figure 1 As shown, embodiments of the present invention include:

[0017] A sandwich alignment pattern transfer process, comprising the following specific steps:

[0018] a. Make a negative, draw 4 to 6 butterfly targets on the edge of the BOT surface of the negative, and draw 4 to 6 butterfly target holes on the edge of the TOP surface of the negative that are compatible with the size and position of the butterfly target on the BOT surface;

[0019] b. Rack the film, stack the TOP surface of the fil...

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Abstract

The invention discloses a sandwich alignment pattern transfer process. The sandwich alignment pattern transfer process comprises the following steps of bottom sheet fabrication, bottom sheet erecting, sandwich alignment, upper plate positioning, exposure and plate discharging. Through the mode, according to the sandwich alignment pattern transfer process, aiming at the problem that interlayer dislocation and deviation are liable to generate by an existing alignment process, 4-6 butterfly-shaped cross target holes are adopted, high-accuracy sandwich alignment can be achieved, the production efficiency is greatly improved, meanwhile, the purchase cost of alignment equipment is omitted, and the production profit is increased.

Description

technical field [0001] The invention relates to the field of image transfer production, processing and manufacturing, in particular to a sandwich alignment pattern transfer process. Background technique [0002] In the SUS production industry, the technology of film alignment in the pattern transfer process will cause unnecessary defects such as layer misalignment and offset, and the alignment accuracy is low. Generally, existing SUS manufacturers are small in scale and need to purchase advanced automatic alignment equipment, resulting in a sharp increase in production costs. Contents of the invention [0003] The technical problem mainly solved by the present invention is to provide a sandwich alignment pattern transfer process. Aiming at the problem that the existing alignment process easily causes interlayer misalignment and offset, the present invention adopts 4 to 6 butterfly cross target holes, which can realize High-precision sandwich alignment greatly improves pro...

Claims

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Application Information

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IPC IPC(8): G03F9/00
CPCG03F9/00
Inventor 夏玉龙杨海涛
Owner 昆山维嘉益材料科技有限公司
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