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Manufacturing method of semiconductor device, semiconductor device, and lead frame

A manufacturing method and lead frame technology, applied in semiconductor/solid-state device manufacturing, semiconductor devices, semiconductor/solid-state device components, etc., can solve problems such as poor connection between bonding wires and inner leads, peeling of semiconductor chips, etc.

Active Publication Date: 2019-04-26
株式会社PANGEA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the inner leads are deformed, there may be cases where, for example, the semiconductor chip is easily peeled off from the inner leads, or poor connection between the bonding wire and the inner leads occurs during wire bonding

Method used

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  • Manufacturing method of semiconductor device, semiconductor device, and lead frame
  • Manufacturing method of semiconductor device, semiconductor device, and lead frame
  • Manufacturing method of semiconductor device, semiconductor device, and lead frame

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Embodiment Construction

[0015] Embodiments will be described below with reference to the drawings. The relationship between the thickness of each constituent element and the planar dimension, the ratio of the thickness of each constituent element, etc. described in the drawings may differ from the actual one. In addition, in the embodiments, substantially the same constituent elements are given the same reference numerals and their descriptions are appropriately omitted.

[0016] As an example of a method of manufacturing a semiconductor device, refer to Figure 1 to Figure 7 An example of a method for manufacturing a TSOP (Thin Small Outline Package: TSOP, Thin Small Outline Package) type semiconductor device will be described. An example of a method for manufacturing a semiconductor device includes a lead frame preparation step, a lead frame processing step, a chip mounting step, a wire bonding step, a resin sealing step, a plating step, and a trimming (T / F) step. The order of the steps is not li...

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PUM

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Abstract

The embodiment of the invention provides a method for manufacturing a semiconductor device capable of suppressing excessive deformation of leads, the semiconductor device and a lead frame. The method includes the steps of extruding a first inner lead while a pressing mechanism abutting against the upper surface of a wiring portion of a second inner lead to make at least the wiring portion to be deformed partially, cutting the connection portion between the end portion and the wiring portion on the extending direction of the first inner lead so separate the wiring portion and the end portion, loading a semiconductor chip, forming a first and second joint wire, forming a sealed resin layer, and cutting off a connection portion between a supporting portion and the first and second leads.

Description

[0001] [Related applications] [0002] This application enjoys the priority of the basic application based on Japanese Patent Application No. 2015-181479 (filing date: September 15, 2015). This application includes the entire content of the basic application by referring to this basic application. technical field [0003] Embodiments of the present invention relate to a method of manufacturing a semiconductor device, a semiconductor device, and a lead frame. Background technique [0004] In a semiconductor device having leads including outer leads and inner leads, and a semiconductor chip, electrode pads of the semiconductor chip and inner leads are electrically connected by bonding wires. Therefore, the longer the distance between the electrode pad and the outer lead, the longer it is necessary to extend the inner lead from the outer lead to the vicinity of the electrode pad. [0005] Long inner leads are easily deformed during the manufacturing process of the semiconduct...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/495H01L21/60
CPCH01L23/49575H01L24/85H01L2224/48247H01L2224/73265
Inventor 石井齐
Owner 株式会社PANGEA