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A method for improving the front edge of gong groove in pcb plate sinking copper

A technology of PCB boards and gongs, which is applied in the manufacture of printed circuits, electrical components, printed circuits, etc., can solve problems such as customer complaints, increased production costs, and high defective rate, and achieve the effect of low cost investment and improved efficiency

Active Publication Date: 2020-06-09
江西科翔电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
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AI Technical Summary

Problems solved by technology

However, in the actual production process, due to human negligence, there are often leaking grooves, and the leaking grooves are not detected during the inspection, and flow to customers, which leads to complaints and complaints from the clients and affects the company's reputation.
At the same time, Phi Feng also has a great impact on subsequent processing, resulting in a high rate of defective products, which not only increases the production cost of the enterprise, but also seriously affects the reputation of the enterprise. It is impossible to occupy market share with high-quality products, which hinders the development of the enterprise. develop

Method used

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Embodiment Construction

[0018] The present invention provides a method for improving the front edge of the gong groove of the PCB board for sinking copper on the PCB. In order to make the purpose, technical solution and effect of the present invention clearer and clearer, the present invention will be further described in detail below. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0019] This embodiment provides a method for improving the front edge of the gong groove of the PCB board sinking copper, including the following steps:

[0020] S1. Select the gong belt according to the material number of the front gong groove of the sinking copper, use the central axis of the PCB as the zero positioning hole, and according to the actual size of the PCB, use the zero positioning hole as the axis to form an equilateral triangle, and place the equilateral triangle The end point is set as a positioning...

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Abstract

The present invention provides a method of improving milling groove burrs before an electroless plating copper operation of a PCB. According to the present invention, the requirements of the customers for the sizes and the PTH grooves are satisfied with the low-cost investment and the high-quality output; by exposing a substrate of a groove milling area, the groove milling area and the circuit board form the strong visual contrast, the operation personnel can identify the missed milling areas in the circuit board very easily, thereby improving the missed milling detection efficiency of the circuit board.

Description

technical field [0001] The present invention designs the technical field of PCB board production, and in particular relates to a method for improving the front edge of gong grooves before sinking copper on PCB boards. Background technique [0002] With the continuous development of PCB technology, the process technology and equipment capabilities of PCB boards have been in a relatively stable state for a certain period of time. However, the market competition is becoming increasingly fierce, and delivery and quality are also the focus of competing customers. The PCB board needs to be grooved before the copper sinking of the PNL board, and the front is often produced during this process, which greatly affects the quality of the product. Moreover, for conventional circuit boards, due to their wide range of use, their appearance specifications are not uniform and their shapes are diversified. Even inside the circuit board, due to the factors of supporting parts, there are more...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00
CPCH05K3/0044H05K2203/0228
Inventor 李叶飞柳超付建云
Owner 江西科翔电子科技有限公司
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