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Light emitting device package structure

A technology for light-emitting components and packaging structures, applied in electrical components, semiconductor devices, circuits, etc., can solve the problems of limited application of light-emitting diodes, and achieve the effects of good light-emitting uniformity and large light-emitting area

Active Publication Date: 2017-03-29
GENESIS PHOTONICS
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  • Abstract
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Problems solved by technology

Based on the directivity characteristics of light-emitting diodes, light-emitting diodes are mostly used in light source devices that locally require high brightness, which limits the application of light-emitting diodes

Method used

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  • Light emitting device package structure
  • Light emitting device package structure
  • Light emitting device package structure

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Experimental program
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Embodiment Construction

[0094] Figure 1A to Figure 1F A schematic cross-sectional view showing a manufacturing method of a light-emitting element packaging structure according to an embodiment of the present invention. It should be noted that, Figure 1A to Figure 1F It is a schematic cross-sectional view shown along one direction (such as X-X direction), so there is only one light-emitting element in each light-emitting element packaging structure formed; but in the other direction (such as Y-Y), each light-emitting element packaging structure There may also be multiple light emitting elements.

[0095] Regarding the manufacturing method of the light-emitting element packaging structure of this embodiment, first, please refer to Figure 1A , providing a wavelength conversion adhesive layer 110 , wherein the wavelength conversion adhesive layer 110 includes a low concentration adhesive layer 112 and a high concentration adhesive layer 114 . Here, the step of forming the wavelength conversion adhesi...

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Abstract

A light emitting device package structure includes at least one light emitting device, a wavelength conversion adhesive layer, and a protection element. The light emitting device has an upper surface, a lower surface opposite to the upper surface, and a side surface connecting the upper surface and the lower surface. The wavelength conversion adhesive layer is disposed on the upper surface of the light emitting device and has a first edge and a second edge opposite to each other. The protection element encapsulates the side surface of the light emitting device and the second edge of the wavelength conversion adhesive layer and exposes the lower surface of the light emitting device. A third edge of the protection element is aligned with the first edge of the wavelength conversion adhesive layer. The light emitting element package structure provided by the present invention can not only have a better lateral light emission effect, but also has a large light emitting area and a better luminous uniformity.

Description

technical field [0001] The invention relates to a packaging structure of a light-emitting element, in particular to a packaging structure of a light-emitting element using a light-emitting diode and a manufacturing method thereof. Background technique [0002] Since light emitting diodes have the advantages of small size and long service life, the application of light emitting diodes as light sources has become more and more common. Since the light emitting diode is a kind of directional light source, the direct light area in front of the light emitting diode usually has higher brightness, while the brightness of the non-direct light area is lower than that of the direct light area. Based on the directivity characteristics of light emitting diodes, light emitting diodes are mostly used in light source devices that locally require high brightness, thereby limiting the application of light emitting diodes. Contents of the invention [0003] The invention provides a light-em...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/50H01L33/54
CPCH01L33/50H01L33/54H01L33/46H01L33/508H01L33/58
Inventor 洪政暐郭柏村杜隆琦张瑞夫林育锋
Owner GENESIS PHOTONICS
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