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Numerical Optimal Design Method for the Thickness of Thermal Insulation Layer of Airborne Flight Parameter Recorder

A flight parameter and numerical optimization technology, applied in design optimization/simulation, electrical digital data processing, instruments, etc., can solve problems such as high testing costs, achieve the effects of improving efficiency, reliable basis and support, and reducing time and cost

Active Publication Date: 2019-05-24
AEROSPACE RES INST OF MATERIAL & PROCESSING TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The entire testing process takes several months, and the cost of prototyping and testing is high

Method used

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  • Numerical Optimal Design Method for the Thickness of Thermal Insulation Layer of Airborne Flight Parameter Recorder
  • Numerical Optimal Design Method for the Thickness of Thermal Insulation Layer of Airborne Flight Parameter Recorder
  • Numerical Optimal Design Method for the Thickness of Thermal Insulation Layer of Airborne Flight Parameter Recorder

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Embodiment Construction

[0040] Below in conjunction with accompanying drawing and specific embodiment the present invention is described in further detail:

[0041] Such as image 3 Shown is the flow chart of the numerical optimization design method for the thickness of the heat insulation layer of the airborne flight parameter recorder of the present invention, and the specific implementation method is as follows:

[0042] Step (1), measuring the thermophysical parameters of the outer casing 1, the heat insulation layer 3, the inner casing 2, the heat storage layer 4 and the chip 5 of the flight parameter recorder; specifically including: the heat insulation layer material within the range of normal temperature to 1100°C The thermal conductivity, density, and specific heat capacity; the density, thermal conductivity, specific heat capacity, phase transition temperature, and latent heat of phase transition of heat storage layer materials in the range from room temperature to 1100 °C; the blackness of...

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Abstract

The invention relates to a numerical optimization design method for the thickness of a heat insulation layer of an onboard flight parameter recorder. According to the method, by using a CFD numerical calculation software, the internal temperature field distribution of the flight parameter recorder in a high-temperature burning process and a medium-temperature baking testing process are calculated, the design time period is shortened to several hours in virtue of computer simulation, and meanwhile material structure parameters can be quickly changed, so that an optimal design scheme is quickly determined; according to the method, the efficiency for optimizing the structure of the flight parameter recorder can be improved, the time and cost for high-temperature testing are reduced, the proportion of the thickness of a heat insulation material to the filling volume of a phase-change heat storage material is adjusted for a given volume of the flight parameter recorder, the temperature of a chip at the moment that unsteady state heat shock simulation is ended in different proportions is recorded, the proportion of the heat insulation layer to the phase-change layer when the chip final temperature is the minimum is selected as an optimal design structure, and the chip of the flight parameter recorder is protected from being broken by a heat shock through structural optimization of the heat insulation layer and a heat storage layer of the flight parameter recorder.

Description

technical field [0001] The invention relates to a numerical optimization design method for the thickness of the heat insulation layer of an airborne flight parameter recorder, which is used for optimizing the structure of the heat insulation layer and the heat storage layer of the flight parameter recorder, and protecting the aircraft parameter recording chip from being damaged by thermal shock. Background technique [0002] In order to record the working status of the aircraft and the operation of the pilot, it provides an objective and effective basis for the investigation of flight accidents. The airborne flight parameter recorder needs to have thermal protection ability against high temperature fire and medium temperature baking. The European Aeronautical Equipment Organization's ED-112 "Minimum Performance Requirements for Crash Airborne Recording Systems" and the US Federal Aviation Administration's TSO-C124b "Technical Standards for Flight Data Recording Systems" both...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F17/50
CPCG06F30/20
Inventor 肖鹏刘清念张扬伟孙陈诚罗正平张西军
Owner AEROSPACE RES INST OF MATERIAL & PROCESSING TECH
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