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Manufacturing method of flexible copper wiring board and flexible copper-clad laminated board with support film used therefor

A manufacturing method and technology for wiring boards, which are applied in bonding methods, chemical instruments and methods, and removal of conductive materials by chemical/electrolytic methods, etc., can solve the problems of lower yield, poor productivity, loss of raw materials, etc., and achieve yield High performance, high productivity and high dimensional stability

Active Publication Date: 2019-10-18
SUMITOMO METAL MINING CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The adjustment of parameters for each batch requires labor and time for process adjustment, resulting in various adverse effects such as loss of raw materials during adjustment, deterioration of product quality deviation, and reduction in yield.
Therefore, when applied to flexible copper-clad laminates that can be used in small electronic devices in recent years, there are problems of lower yield and poor productivity.

Method used

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  • Manufacturing method of flexible copper wiring board and flexible copper-clad laminated board with support film used therefor
  • Manufacturing method of flexible copper wiring board and flexible copper-clad laminated board with support film used therefor

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0050]

[0051] On one side of the usual CTE (Coefficient Of Thermal Expansion, coefficient of thermal expansion) grade polyimide resin (thickness: 38 μm, manufactured by Toray-DuPont Japan: Kapton150EN) as a resin film, 8 μm of copper is laminated by sputtering and electroplating, Further, a support film (thickness: 50 μm, improved PET film, heat shrinkage specification: 0.1% or less) is laminated on one side of the polyimide resin surface with an adhesive to form a flexible copper clad laminate with a support film Plate samples. In addition, a sample of a flexible copper-clad laminate not laminated with a support film was produced. It should be noted that the length of each sample is 156 mm in the MD direction and 160 mm in the TD direction.

[0052]

[0053] The above samples were subjected to etching treatment, heat treatment and peeling treatment of the supporting film. In addition, the peeling process of the support film was not performed to the sample to which the...

Embodiment 2

[0056] The test was carried out in the same manner as in Example 1, except that the resin film was made of low-CTE grade polyimide resin (thickness: 38 μm, manufactured by Toray-DuPont Japan: Kapton 150ENA).

Embodiment 3

[0058] Except having used the polyimide resin (thickness: 35 micrometers, manufactured by Ube Industries, Ltd.: Upilex35SGA) of the usual CTE grade as a resin film, it tested similarly to Example 1.

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Abstract

Flexible copper wiring boards for chip-on-film (COF), flexible printed wiring boards (FPC), and the like are manufactured with good precision from flexible copper-clad laminates. It is equipped with a process of laminating copper on one side of the resin film, a process of laminating a biaxially stretched film as a support film on the other surface of the resin film through an adhesive layer, a process of etching copper to form copper wiring, and heating the substrate with the support film. Heating process of the flexible copper-clad laminate, and peeling process of peeling the support film; as the support film, a film having a thermal shrinkage rate of 0.1% or less at 150°C x 30 minutes in each stretching direction of the biaxially stretched film is used .

Description

technical field [0001] The present invention relates to the manufacturing method of the flexible copper wiring board that is used for chip on film (Chip On Film, COF), flexible printed wiring board (Flexible Printed Circuit, FPC) etc. Copper Clad Laminate, FCCL). Background technique [0002] Since the resin film is flexible and easy to process, a metal film or an oxide film is formed on the surface thereof, and is widely used in the industrial field for electronic components, optical components, packaging materials, and the like. For example, flexible wiring boards are used in small electronic devices such as mobile phones. [0003] As a method of manufacturing a flexible copper wiring board, for example, a flexible copper-clad laminate having a metal thin film formed on one surface of a resin film is used as a starting material, and an unnecessary part of the metal thin film is removed by a selective etching process. , Forming a wiring pattern, going through a plating pr...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/06B32B15/08B32B15/088B32B15/09C09J5/00C09J7/20
CPCB32B15/08B32B15/088B32B15/09C09J5/00H05K3/06C09J7/20
Inventor 猪狩敦
Owner SUMITOMO METAL MINING CO LTD
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