A kind of laminated board, metal foil clad laminated board and multilayer printed circuit board

Abstract

The invention provides a laminated board, a metal foil-coated laminated board and a multilayer printed circuit board. The laminated board comprises at least more than two prepreg layers, wherein at least one of the prepreg layers uses a reinforcing material of which the mass per unit area is different from those of the other layers, and the difference among z-CTEs of the prepreg layers is within plus or minus 10%. The consistency among vertical coefficients of thermal expansion of the layers of the laminated board prepared by the invention is improved, and weak points among the layers are eliminated, so that the uniformity of the overall performance of the laminated board is improved, the laminated board has excellent heat resistance, and situations of local deformation and crack after the laminated board is heated are significantly improved.

Description

Technical field [0001] The invention belongs to the technical field of laminates, and relates to a laminate, a metal-clad laminate and a multilayer printed circuit board. Background technique [0002] Under the ever-changing trend of electronic technology, integrated circuits are thinking about the rapid development of ultra-large-scale, high-frequency, high-speed, high-density, high-power, high-precision, and multi-function directions. Therefore, the requirements for copper clad laminates are getting higher and higher. . In particular, the dimensional stability of the plate has higher requirements for the coefficient of thermal expansion (CTE), thickness uniformity and composition uniformity of the plate. [0003] The control of CTE is generally improved by adding inorganic fillers, and no matter what the unit weight of the reinforcing material is coated with the same filler content resin glue, the CTE of the board can be effectively controlled in this way, but the board’s Unifo...

AI Technical Summary

Problems solved by technology

[0003] The control of CTE is generally improved by adding inorganic fillers, and no matter what kind of reinforcing material per unit weight is coated with resin glue with the same filler content, the CTE of the board can be effectively controlled in this way, but the board’s Uniformity cannot be guaranteed, especially for multi-layer boards with different unit weights. Since the reinforcing material is actually a kind of inorganic filler, it not only plays the role of reinforcement, but also plays a role in reducing CTE. Different unit weights When the reinforcing material is coated with the same glue formula, the filler content is actually different, and the performance between layers is also different, especially the vertical expansion coefficient (z-CTE) is inconsistent, and there are weak points between layers, causing heat After local deformation and delamination

[0004] CN101395208A discloses a kind of interlayer material and laminated plate, although by making the cured material of interlayer material in the range of greater than or equal to 25 ℃ and less than or equal to the glass transition temperature, plane linear expansion coefficient is less than or equal to 20ppm / ℃, through such material It makes the laminate have excellent punching processability and high plane dimensional stability, but it cannot solve the problem of the difference in performance between the layers of the laminate and the inconsistent vertical expansion coefficient

Images