Security method based on electronic information system keys

Abstract

The invention provides a security method based on electronic information system keys. The make-and-break device is provided with a single-pole double-throw relay. When the switch unit of a micro-electromechanical system matrix is required to be used for the switching of wiring lines, firstly, the current has to be cut off across the micro-electromechanical system matrix; the micro-electromechanical system matrix is used to realize the switching of wiring lines, which comprises a plurality of micro-electromechanical system switches; the hanging beams of the micro-electromechanical system switches are arranged in such a manner that the inclined angles between the hanging beams are not zero; a micro-electromechanical sensor fixing device is a fixing platform for a micro-electromechanical sensor adjusting device and a step-progress type displacement platform; and the other wire coil without electricity forms an induction wire coil. Through the measurement of the voltage or the current exerted by the excitation coil wire, it is possible to calculate the magnetic field strength H of an accompanying pipe unit corresponding to the magnetic field strength of the micro-electromechanical mechanical system.

Description

technical field [0001] The invention belongs to the technical field of electronic information, in particular to a security method based on an electronic information system key. Background technique [0002] The silicon substrate forms the back volume to oxidize the porous silicon structure, and sequentially vapor-deposit and etch a conductive layer, a metal layer, a silicon oxide film, etc. to form the porous silicon structure (steps 1a-1h). In order to form the porous silicon structure, multiple processes must be performed, and thus the manufacturing time of the MEMS microphone may be significantly increased. In addition, since the oxidation rate of silicon in the porous silicon structure may be uneven depending on voltage conditions, the back volume may also be etched unevenly. When the surface of the back volume is etched unevenly, the distance between the vibrating membrane (diaphragm) and the supporting plate becomes uneven, making it difficult to accurately convert so...

AI Technical Summary

Problems solved by technology

The manufacturing time of MEMS microphones can be significantly increased due to the number of steps necessary to form the porous silicon structure

In addition, since the oxidation rate of silicon in the porous silicon structure may be uneven depending on voltage conditions, the back volume may also be etched unevenly.

When the surface of the back volume is etched unevenly, the distance between the vibrating membrane (vibrating plate) and the support plate becomes uneven, making it difficult to accurately convert sound into electrical signals