Method for inspecting flux coating state of flip chip
A flip-chip, state inspection technology, used in semiconductor/solid-state device testing/measurement, electrical components, circuits, etc., can solve the problems of flux characteristics change, high price, and difficulty in easily checking whether the flux is coated or not. To achieve the effect of accurate inspection
Active Publication Date: 2017-05-03
HANWHA AEROSPACE CO LTD
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Problems solved by technology
However, in this method, since the flux is made of liquid, its traces disappear instantly, and there is a problem that it is difficult to easily check whether the flux is applied to the chip bumps.
[0017] In addition, there is also a technique of adding identifiable other additives to the flux to enable the identification process easily, however with this technique, there may be a problem of changes in the characteristics of the flux
[0018] In addition, it has also been proposed to check whether the flux is applied to the chip bump by using a camera to capture a video or image of the state where the flux is applied to the chip bump. However, in this case, Since flux is a colorless liquid, it is necessary to use a camera with an expensive lens in order to accurately judge the state of the flux applied to the bumps of the chip, and there is a problem of cost burden
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[0049] The advantages and features of the present invention and methods for achieving them will become more apparent with reference to the embodiments described in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, and can be implemented in various forms that are different from each other. However, the purpose of providing this embodiment is to completely disclose the present invention, and to make it common in the technical field to which the present invention belongs. Those skilled in the art fully recognize the scope of the present invention, and the present invention is defined only by the scope described in the claims. Throughout the specification, the same reference symbols refer to the same constituent elements.
[0050] In addition, the embodiments described in this specification will be described with reference to cross-sectional views and / or schematic views which are ideal exemplary vi...
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The present invention relates to a method of inspecting a flux coating state of a flip chip, comprising the steps of applying a flux to a bump of a flip chip; identifying a bump position of the flip chip and correcting a reflection light having a wavelength range for a specific area having a high absorption rate of the flux is irradiated to the bump of the flip chip; and a reflection light reflected from the bump by the illumination light The light is photographed to obtain a video or image; and reading the acquired video or image to check the coating state of the flux against the bump of the flip chip.
Description
technical field [0001] The present invention relates to a method for inspecting the coating state of soldering flux of a flip chip, and more particularly, to a method for irradiating light having a wavelength range of a specific region that flux can absorb most strongly, thereby A method of checking the flux coating state of a flip chip by using the difference in light intensity. Background technique [0002] In recent years, with the development of electronic communication technology, electronic equipment tends to be more and more miniaturized and lightweight. Therefore, electronic components (for example, semiconductor chips) incorporated in various electronic devices must be highly integrated and miniaturized. [0003] Therefore, surface mount components for mounting high-density, ultra-small surface mount components (SMD: Surface Mount Device) on printed circuit boards (PCB: Printed Circuit Board, hereinafter referred to as "substrates") Technical research is actively ...
Claims
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IPC IPC(8): H01L21/66
CPCH01L22/12
Inventor 李容在
Owner HANWHA AEROSPACE CO LTD