Film-sticking mold and film-sticking process

A film and mold technology, which is applied in the field of film film molds and film film technology, can solve the problems of high labor intensity and low film film efficiency, and achieve the effects of reducing labor intensity, improving film film efficiency, and reducing the degree of manual participation

Inactive Publication Date: 2017-05-10
SHENZHEN TINNO WIRELESS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the traditional technology, the required film is often attached to the glass plate by manual film sticking. However, this method has the problems of high labor intensity and low film sticking efficiency.

Method used

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  • Film-sticking mold and film-sticking process

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Embodiment Construction

[0036] The present application will be described in further detail below through specific embodiments and in conjunction with the accompanying drawings.

[0037] Such as figure 1 and figure 2 As shown, the embodiment of the present application provides a film lamination mold, which is used to attach a film 10 to a glass plate 11, where the film 10 may be a protective film, a decorative film or a film with other functions. The film sticking mold specifically includes an upper mold, a lower mold and a force medium filling device (not shown in the figure), the upper mold and the lower mold are arranged oppositely, and the two can move relative to each other, and one of the two is installed on a glass plate mold 20, the other is a film positioning mold 21, and the glass plate mounting mold 20 is provided with an installation groove 200 for accommodating the glass plate 11. The film positioning mold 21 has a film positioning surface 210 and a hole that passes through to the film ...

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PUM

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Abstract

The invention relates to the technical field of film sticking, in particular to a film-sticking mold and a film-sticking process. The film-sticking mold is used for sticking a film to a glass plate and comprises an upper mold, a lower mold and a force exerting medium filling device, wherein one of the upper mold and the lower mold is a glass plate installing mold, the other is a film positioning mold, the glass plate installing mold is provided with an installing groove for containing the glass plate, the film positioning mold is provided with a film positioning surface and a medium filling hole penetrating through the film positioning surface, and the force exerting medium filling device exerts an sticking force close to the glass plate through the medium filling hole. The film-sticking mold can fill a force exerting medium into the film positioning mold through the force exerting medium filling device, so that the film is close to the glass plate under the effect of the force exerting medium and sticks to the glass plate together, and accordingly the film-sticking operation of the glass plate is completed. The film-sticking mold can reduce the artificial participation degree in the film-sticking process, further the labor intensity in the film-sticking process is reduced, and the film-sticking efficiency is improved.

Description

technical field [0001] The present application relates to the technical field of film sticking, in particular to a film sticking mold and a film sticking process. Background technique [0002] The glass plate is a structure that is used in most electronic products. In order to protect the glass plate or improve the appearance of the glass plate, a film is attached to the glass plate. The film can be a protective film or a decorative film. [0003] In the traditional technology, the required film is often attached to the glass plate by manual film attachment. However, this method has the problems of high labor intensity and low film attachment efficiency. Contents of the invention [0004] The application provides a film-attaching mold and a film-attaching process, so as to reduce the labor intensity in the film-attaching process and improve the film-attaching efficiency. [0005] The first aspect of the present application provides a film sticking mold, which is used to s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B37/00B32B37/02
CPCB32B37/0046B32B37/02
Inventor 刘汉林
Owner SHENZHEN TINNO WIRELESS TECH
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