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Testing structure and testing method of integrated packaged multichannel surface acoustic wave filter set

A surface acoustic wave and filter bank technology, which is applied in the direction of electronic circuit testing, instruments, measuring electronics, etc., can solve the problems of cumbersome process and inconvenient operation, and achieve the effect of high isolation, avoiding influence, and compact test structure

Active Publication Date: 2017-05-10
YANGZHOU UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The testing method of the surface acoustic wave filter bank in the prior art and application mainly uses its external switch gating circuit to switch each filter channel and perform measurement one by one. The measurement results often include the influence of the external circuit, and the process is cumbersome. Inconvenient to operate

Method used

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  • Testing structure and testing method of integrated packaged multichannel surface acoustic wave filter set
  • Testing structure and testing method of integrated packaged multichannel surface acoustic wave filter set
  • Testing structure and testing method of integrated packaged multichannel surface acoustic wave filter set

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] Such as Figure 1(a) , Figure 1(b) and Figure 4 As shown, the test structure for the integrated package 4-channel surface acoustic wave filter bank is:

[0034] ⑴Using FR-4 high-frequency double-sided copper-clad board to make test substrate 1, the middle part of the test substrate is the test jack area 2, and the two sides of the test jack area 2 are copper film signal wires (including the left copper film signal wire and the right copper film signal wire). film signal wires), the back of the test substrate 1 is a copper film ground plane, and the two ends of the test substrate 1 are the radio frequency connector base area 5 including the center electrode jack 51 of the radio frequency connector and the ground pin jack 52 .

[0035] (2) The test jack area includes 2 sets of jacks (the first set of jacks 21, the second set of jacks 22), each set of jacks includes a pair of grounding jacks 202 and are symmetrically distributed on the upper and lower sides of the pair ...

Embodiment 2

[0044] Such as Figure 2(a) , Figure 2(b) and refer to Figure 4 As shown, the test structure for integrated packaging of 6-channel surface acoustic wave filter banks (N is not a multiple of 4) is:

[0045] ⑴Using FR-4 high-frequency double-sided copper-clad board to make the test substrate 1, the middle part of the test substrate is the test socket area 2, the two sides of the test socket area are copper film signal wires, the back of the test substrate is the copper film ground plane 4, and the test substrate The two ends are the radio frequency connector base area 5 including the central electrode jack 51 and the ground pin jack 52 of the radio frequency connector.

[0046] (2) The test jack area contains 3 groups of jacks (including the first group of jacks 21, the second group of jacks 22, and the third group of jacks 23), each group of jacks includes a pair of grounding jacks 202 and are symmetrically distributed on The six signal jack pairs 201 on the upper and lowe...

Embodiment 3

[0057] Such as Figure 3(a) , Figure 3(b) and refer to Figure 4 As shown, the specific implementation steps for integrated packaging of 8-channel surface acoustic wave filter banks (N is a multiple of 4) are:

[0058] (1) Use FR-4 high-frequency double-sided copper-clad board to make test substrate 1. The middle part of the test substrate is the test jack area 2. The two sides of the test jack area 2 are copper film signal wires. The back of test substrate 1 is the copper film ground plane. The two ends of the substrate 1 are the radio frequency connector base area 5 including the central electrode insertion hole 51 of the radio frequency connector and the ground pin insertion hole 52 .

[0059] (2) The test jack area contains 4 groups of jacks (including the first group of jacks 21, the second group of jacks 22, the third group of jacks 23, and the fourth group of jacks 24), and each group of jacks contains a grounding jack The pair of holes 202 and the eight signal jack...

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Abstract

The invention relates to a testing structure and a testing method of an integrated packaged multichannel surface acoustic wave filter set. The testing structure comprises a testing substrate and an RF joint. The middle part of the front surface of the testing substrate is provided with a plurality of sets of testing jacks. Each set of testing jacks comprises one grounding jack pair and a plurality of signal jack pairs which are respectively arranged at the upper side and the lower side of the grounding jack pair. According to each electrode pin pair which corresponds with the integrated packaged multichannel surface acoustic wave filter set, the left jacks and the right jacks of the jack pair are arranged in a left row and a right row in the vertical direction. Each set of testing jacks are separately arranged in the vertical direction and furthermore are successively staggered by one hole from left to right. Two sides of the testing jacks are provided with metal film signal leads which are connected with the testing jacks and the RF joint. The back surface of the testing substrate is a metal film grounding surface. In testing, through a series of operations such as insertion, translation and rotation on a to-be-tested device, and direct testing on each filtering channel of the integrated packaged multichannel surface acoustic wave filter set is finished. The testing structure is compact, and high convenience in testing operation is realized.

Description

technical field [0001] The invention relates to a test structure and method for an integrated packaging multi-channel surface acoustic wave filter bank, belonging to the technical field of microelectronic device testing. Background technique [0002] The surface acoustic wave filter bank is composed of multiple surface acoustic wave filters, equipped with high-frequency switch gating and impedance matching circuit, which can realize one or more input, multiple or one output of the signal, and the output signal is divided according to the frequency , Widely used in military or civilian wireless communication fields such as frequency synthesis and signal identification. [0003] The integrated package surface acoustic wave filter bank is composed of several surface acoustic wave filters corresponding to different channels made on a single piezoelectric substrate and packaged in a single package. [0004] The package body of a conventional integrated package multi-channel surf...

Claims

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Application Information

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IPC IPC(8): G01R31/28
CPCG01R31/2889
Inventor 赵成陈磊郭鹏飞胡经国
Owner YANGZHOU UNIV
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