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Fingerprint identification module and packaging method

A fingerprint recognition module and fingerprint recognition technology, applied in character and pattern recognition, acquisition/organization of fingerprints/palmprints, instruments, etc., can solve the problem of low fingerprint recognition sensitivity, and achieve low fingerprint recognition sensitivity and enhanced sensitivity Effect

Inactive Publication Date: 2017-05-10
苏州科阳半导体有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] In view of this, the embodiment of the present invention provides a fingerprint recognition module and its packaging method to solve the technical problem of low fingerprint recognition sensitivity caused by the formation of thick packaging glue in the packaging process of the existing fingerprint recognition module

Method used

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  • Fingerprint identification module and packaging method
  • Fingerprint identification module and packaging method
  • Fingerprint identification module and packaging method

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Embodiment

[0045] figure 1 It is a schematic flowchart of a packaging method for a fingerprint identification module provided by an embodiment of the present invention, and an embodiment of the present invention provides a packaging method for a fingerprint identification module. see figure 1 The packaging method of the fingerprint identification module provided by the embodiment of the present invention may include the following steps:

[0046] S110, providing a glass substrate, and filling ink on the glass substrate to form an ink cover.

[0047] Exemplary, Figure 2a is a schematic top view of a glass substrate provided by an embodiment of the present invention, as shown in Figure 2a As shown, the shape of the glass substrate 10 can be circular. Optionally, the shape of the glass substrate 10 can also be rectangular, triangular or other shapes. In the embodiment of the present invention, the shape of the glass substrate 10 is not limited, and only circular Glass substrates are ex...

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Abstract

The invention discloses a fingerprint identification module and a packaging method and relates to a field of fingerprint identification module packaging technology. The method includes providing a glass substrate and filling the glass substrate with oil ink so as to form an oil ink cover board; cutting the oil ink cover board and forming a single piece of oil ink cover board; providing a single piece of fingerprint identification chip and bonding the single piece of the fingerprint identification chip on the surface of the single piece of the single oil ink cover board; filling a filler into the surface of the single piece of the oil ink cover board in the surrounding of the single piece of the fingerprint identification chip and controlling the filler to be flush with or lower than the single piece of the fingerprint identification chip, enabling the induction zone of the single piece of the fingerprint identification chip to be exposed and thus obtaining fingerprint identification module. By adopting the technical scheme, the filler is disposed in the surrounding of the fingerprint identification chip; the induction zone of the single piece of the fingerprint identification chip does not have the filler and the induction zone of the single piece of the fingerprint identification chip is exposed, so that fingerprint identification sensitivity is enhanced.

Description

technical field [0001] The invention relates to the technical field of fingerprint recognition module packaging, in particular to a fingerprint recognition module and a packaging method thereof. Background technique [0002] With the rapid development of mobile smart terminal technology, users have an increasing demand for mobile terminals, and at the same time have higher and higher requirements for mobile smart terminal experience. Biometric technology is also being continuously applied to mobile smart terminals. Among them, fingerprint recognition technology is one of the most mature technologies and one of the most concerned by consumers, and with the continuous improvement of mobile payment security requirements, fingerprint recognition modules will become an essential device for mobile smart terminals, mobile payment terminals and other equipment, and , the sensitivity of fingerprint recognition has increasingly become the research focus of fingerprint recognition mod...

Claims

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Application Information

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IPC IPC(8): H01L23/31H01L21/56G06K9/00
CPCH01L21/56H01L23/3121H01L23/3171G06V40/12
Inventor 朱文辉赖芳奇吕军沙长青
Owner 苏州科阳半导体有限公司
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