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A processing method for arbitrary three-dimensional microstructure

A processing method and microstructure technology, applied in microstructure technology, microstructure device, manufacturing microstructure device, etc., can solve the problems of high cost, complex processing technology, complex processing process, etc., and achieve low cost, large promotion space, Simple to use effects

Active Publication Date: 2017-11-07
GUANGDONG UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The processing technology is complex and the processing equipment is expensive
Binary optical technology faces multiple mask overlay and alignment problems, and the processing process is complex
Three-beam direct writing technology belongs to point-by-point processing technology, which has low processing efficiency and high cost, and is not suitable for batch processing
However, there is still no method to obtain arbitrary three-dimensional microstructures by metal-assisted chemical etching.

Method used

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  • A processing method for arbitrary three-dimensional microstructure
  • A processing method for arbitrary three-dimensional microstructure
  • A processing method for arbitrary three-dimensional microstructure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0066] Embodiment 1-a kind of three-dimensional microchannel array, comprises following preparation method:

[0067] (1) Pre-etching treatment: the size is 10x10x0.5cm 3 (length*width*height), doping type is p-type, resistivity 1-10Ω*cm, crystalline silicon block pieces placed in concentrated sulfuric acid (mass concentration 96%) and hydrogen peroxide (Mass concentration is 30%) Soak in a mixed 120°C hot solution with a volume ratio of 1:1 for 10 minutes to fully remove the oxide on the surface of the block; then take the block out of the solution and rinse it with a large amount of deionized water ; Dry it in a nitrogen stream; take it out after drying;

[0068] (2) photolithography method forms mask: spin-coat one deck 400nm thick photoresist on the block substrate that step (1) obtains, dry, add the mask plate of required lattice microstructure, and Exposure is carried out in a photolithography machine, and the exposed photoresist is developed and removed; then the resi...

Embodiment 2

[0080] Embodiment 2-a kind of three-dimensional microgroove array, comprises following preparation method:

[0081] (1) Pre-etching treatment: the size is 10x10x0.5cm 3 (length*width*height), doping type is p-type, resistivity 1-10Ω*cm, crystalline silicon block pieces placed in concentrated sulfuric acid (mass concentration 96%) and hydrogen peroxide (Mass concentration is 30%) Soak in a mixed 120°C hot solution with a volume ratio of 1:1 for 10 minutes to fully remove the oxide on the surface of the block; then take the block out of the solution and rinse it with a large amount of deionized water ; Dry it in a nitrogen stream; take it out after drying;

[0082] (2) spin coat one deck of 450nm thick photoresist on the block substrate that step (1) obtains, dry, add the required micro-groove mask plate, and be placed on photolithography machine and expose, The exposed photoresist is removed by development; the remaining exposed photoresist is removed by reactive ion etching...

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Abstract

The invention discloses a machining method for any three-dimensional microstructure. The machining method comprises the following steps: (1) cleaning and drying a workpiece made of silicon or an III-V family semiconductor material; (2) spinning a substrate of the workpiece with a layer of photoresist, covering a mask being of a needed microstructure shape, exposing, and removing the exposed photoresist by developing; removing the exposed photoresist; evaporating a titanium (Ti) layer and a gold (Au) layer; (3) mapping each segment of an etching path to three directions of axes x, y and z respectively; configuring corresponding etching solutions according to different etching rotation angles, wherein the etching solutions can be used for etching along a certain crystal direction of the workpiece; (4) placing the workpiece into the etching solution at a corresponding initial angle for etching; (5) taking the workpiece out, and the soaking the workpiece into the etching solution at the corresponding preset etching rotation angle for etching; if a plurality of rotation bending points are required, repeating the step (4) to the step (5). By adopting the machining method, a complex three-dimensional microstructure conforming to any rule can be formed on the workpiece; the method is easy to operate, and is low in cost.

Description

technical field [0001] The invention relates to the technical field of integrated circuit manufacturing technology, in particular to a processing method for any three-dimensional microstructure. Background technique [0002] Microstructures widely exist in microfluidic chips, biochips, and microelectronic devices, and are often used in various important applications such as controlling various chemical reactions, screening abnormal cells, genetic testing, and electrical channels. Among them, microfluidic chips are widely used in life sciences, analytical chemistry, medical testing, food hygiene, environmental monitoring and other fields due to their characteristics of miniature, fast, efficient, integrated, automatic, energy-saving and low reagent consumption. However, due to the needs of functions such as precise detection and control of reactions, three-dimensional microstructures with relatively complex shapes are often required, and the requirements for the shape and sur...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B81C1/00
CPCB81C1/00373B81C1/00412B81C1/00849B81C2201/01B81C2201/0198
Inventor 陈云李力一麦锡全陈新刘强汪正平
Owner GUANGDONG UNIV OF TECH