Batch testing method for semiconductor chips based on fault data grayscale map

Abstract

The invention discloses a batch test method for semiconductor chips based a grayscale map of fault data. The method comprises the steps of 1) construction of a test data matrix X in which each batch comprises m chips, each chip includes n test parameters, test data of the batch includes m*n variable data, and the m*n test data matrix X is formed; 2) determination of quality classification and intervals in which quality classification and parameter intervals of each test parameter of the chip are determined; 3) coloring the test data matrix X according to quality classification and converting the matrix into a quality level matrix Q; 4) construction of the grayscale map of fault data in which each element in the quality level matrix Q serves as one element in a 2D planar image, and the grayscale map of fault data of the batch of chip test dataset is obtained; and 5) rapid chip quality level and defect parameter identification according to the grayscale map of the fault data. According to the method, test data of the semiconductor chips can be analyzed in a batch manner, the chip quality is leveled and sorted rapidly, and the chip defects are analyzed rapidly.

Description

technical field [0001] The invention relates to the technical field of semiconductor chip batch testing, in particular to a semiconductor chip batch testing method. Background technique [0002] The quality of semiconductor chips is reflected by a set of different units and different types of test data. When semiconductor chips are mass-produced, it is necessary to quickly analyze thousands of test data, perform quality classification, analyze defect distribution characteristics and find out the reasons. Due to the multidimensionality of the test data and the real-time requirements of the test, it is difficult to achieve satisfactory results with univariate data statistical analysis methods and traditional multidimensional data statistical methods. [0003] The inventor obtained the national invention patent "Complex electromechanical system state assessment method based on two-digit color digital atlas" (patent number: ZL201110146488.5), and the related paper "Plant-widequ...

AI Technical Summary

Problems solved by technology

[0004] However, the previously disclosed technologies are still unable to solve the problems of rapid quality grading of large batches of semiconductor chips, analysis of defect distribution characteristics, and identification of causes when faced with high-dimensional, non-sequential semiconductor chip batch quality testing.

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