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Wafer rotational speed detection device in megasonic cleaning, cleaning system and working process of cleaning system

A technology of megasonic cleaning and speed detection, which is applied to the manufacture of devices using electric/magnetic methods, electrical components, semiconductor/solid-state devices, etc., can solve the problems that the speed of megasonic cleaning wafers cannot be detected, and improve work efficiency And quality, easy to use, simple structure effect

Active Publication Date: 2017-05-17
BEIJING SEMICORE PRECISION MICROELECTRONICS EQUIP CO LTD
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AI Technical Summary

Problems solved by technology

[0005] The object of the present invention is to provide a wafer rotation speed detection device in megasonic cleaning, a cleaning system and its working process, to solve the technical problem that the wafer rotation speed cannot be detected in megasonic cleaning; and to solve the problems of improving work efficiency and work quality

Method used

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  • Wafer rotational speed detection device in megasonic cleaning, cleaning system and working process of cleaning system
  • Wafer rotational speed detection device in megasonic cleaning, cleaning system and working process of cleaning system
  • Wafer rotational speed detection device in megasonic cleaning, cleaning system and working process of cleaning system

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Embodiment Construction

[0034] Examples see figure 1 As shown, the cleaning system includes a megasonic cleaning tank, a megasonic generating device 9 connected to the megasonic cleaning tank, and a first driving pulley 5, a second driving pulley 6 and a driven pulley arranged in the megasonic cleaning tank. Pulley assembly 7, see figure 2 , image 3 As shown, the driven pulley assembly 7 includes a wafer rotor 73, the wafer rotor 73 is cylindrical, and the center of one end is provided with a cylindrical keyway along the long direction to form a keyway section, and the other end is provided with a card slot along the circumferential direction. The slot connecting the wafer forms a slot section, and the key slot section and the slot section are connected by a transition section. The wafer rotor shield 72, wafer rotor shield 72, and wafer The rotor pulley cover 74 and the driven pulley 71, wherein the wafer rotor pulley cover 74 has a keyway; the driven pulley 71 is a metal part, the wafer rotor sh...

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Abstract

The invention relates to a wafer rotational speed detection device in megasonic cleaning, a cleaning system and working process of the cleaning system. The detection device is connected with a driven pulley assembly and comprises a second magnetic ore, a first magnetic core, a counting plate and a rotational speed sensor, wherein the second magnetic core is internally arranged in a key slot at one end of a wafer rotor, the first magnetic core is embedded into a wafer rotor pulley sleeve, the counting plate is connected with an end part of a driven pulley, the rotational speed sensor is arranged at a side edge of the counting plate, the second magnetic core is arranged at a central position of the device, the first magnetic core is arranged at one side of the second magnetic core, and the first magnetic core and the second magnetic core are arranged oppositely. By the detection device, the problems existing for a long time of the prior art is solved; with the adoption of the device, wafer rotation detection can be rapidly, accurately and effectively completed; and the device is simple in structure and low in cost, is convenient to use, the working efficiency and the quality are favorably improved, and the device can be widely applied to the fields of chemical mechanical planarization (CMP), thinning and the like of a wafer.

Description

technical field [0001] The invention relates to the field of wafer cleaning, especially chemical mechanical polishing equipment and working process. Background technique [0002] With the continuous development of integrated circuit (Integrated circuit, IC) manufacturing technology, the feature size of the chip is getting smaller and smaller, the number of interconnection layers is increasing, and the diameter of the wafer is also increasing. To achieve multi-layer wiring, the surface of the wafer must have extremely high flatness, smoothness and cleanliness, and chemical mechanical polishing (Chemical Mechanical Planarization, CMP) is currently the most effective wafer planarization technology, and photolithography, etching Erosion, ion implantation, and thin film deposition are called the five core technologies of the IC manufacturing process. [0003] Due to the chemical reaction at the interface of the polished wafer and the existence of abrasive particles, surface defe...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67G01P3/44
Inventor 熊朋史霄舒福璋陶利权费玖海
Owner BEIJING SEMICORE PRECISION MICROELECTRONICS EQUIP CO LTD
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