Method and device for enabling placement machine to accurately absorb materials

Abstract

The present invention provides a method and device for allowing a chip mounter to accurately absorb materials. Lower portion of the discharge port of a feeder is provided with a metal inductor, the materials on the distance D between the material strap at the discharge port and the induction surface of the metal inductor is not larger than the detection distance L of the metal inductor, and there is not more than one material in the detection distance L; through the signals fed back to the control system of the chip mounter, it is detected whether the material strap at the discharge port has materials or not after the corresponding motion: after the material strap discharges materials, if the metal inductor at the lower portion of the discharging port inducts metal signals, there are materials on the material strap, and the materials are normally discharged; if the metal inductor does not induct the metal signals, there is no material on the material strap, and the materials are not normally discharged; and after the suction nozzle of the chip mounter is subjected to absorption operation, if the metal inductor does not induct the metal signals, there is no material on the material strap, and the materials are successfully absorbed; and if the metal inductor inducts the metal signals, there are materials on the material strap, and the materials are not successfully absorbed. The cost is saved, the production efficiency is improved, and the finished-product yield rate is improved.

Description

technical field [0001] The invention relates to the field of placement machine devices, in particular to a method and a device for enabling a placement machine to accurately absorb materials. Background technique [0002] Under the premise of the gradual localization of LED placement machines, compared with imported placement machines, the stability of domestic placement machines is relatively poor. Phenomena such as material leakage by the placement head nozzle cannot be accurately detected, resulting in the loss of too many components on the circuit board, which affects the yield of the circuit board, and will consume a lot of manpower and material resources to deal with it. Therefore, domestic placement machines need to find a method that can improve the detection accuracy of placement machines. [0003] In the prior art, there are two existing methods for detecting materials: [0004] Method 1: Use the machine vision system to monitor the suction nozzles that have been...

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Problems solved by technology

[0004] Method 1: Use the machine vision system to monitor the suction nozzles that have been sucked, and check whether the suction nozzles are normally sucking components; the disadvantages of this method are: (1) The machine vision system needs a long time Time affects placement efficiency; (2) The cost of this method is high, the technical requirements are high, and the domestic technology is not yet mature, and the reliability of the technology is low

[0005] Method 2: By detecting the vacuum degree when the suction nozzle of the placement machine absorbs the material, it is judged whether the component material is normally absorbed; the defects of this method are: (1) the cost is too high; (2) the suction nozzle will also The suction of dust in the air will affect the pore size of the suction nozzle, resulting in large fluctuations in the vacuum degree at the suction nozzle, requiring frequent adjustment of the vacuum feedback value, so the reliability is low

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