Substrate processing equipment and alignment control method of to-be-processed substrate
A technology of processing equipment and control method, which is applied in semiconductor/solid-state device manufacturing, instruments, electrical components, etc., and can solve the problems of poor reflective performance of alignment marks and inaccurate alignment results, etc.
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[0031] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0032] An embodiment of the present invention provides a substrate processing equipment, such as figure 1 As shown, it includes: a stage 10 for carrying a substrate 11 to be processed, an alignment mark a is provided on the substrate 11 to be processed, and the alignment mark a is a light-shielding material. The light source 20 is disposed on one side of the stage 10 . The image sensor 30 is disposed on the other side of the stage 10 . Wherein, the light sou...
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