A miniaturized three-dimensional inverted t/r assembly

Abstract

The invention provides a miniaturized three-dimensional inverted T / R component. The upper end and the lower end of an H-shaped structural part are each provided with a cavity body and are closed by cover plates; the upper cavity body is internally provided with a power divider and a control circuit module by an LTCC (Low Temperature Co-Fired Ceramic) substrate, and the lower cavity body is internally provided with four T / R radio-frequency modules by an LTCC substrate; the LTCC substrates in the upper cavity body and the lower cavity body are communicated by an LTCC connector; the LTCC substrate in the upper cavity body are communicated with a radio-frequency joint and a multi-core micro rectangular joint which are led out downwards and penetrate through an opening of the lower cover plate and are respectively used as a power divider junction and a power supply control interface; the LTCC substrate in the lower cavity body is communicated with four radio-frequency joints which are led out upwards and are connected with a radiating antenna by an opening of the upper cover plate. The miniaturized three-dimensional inverted T / R component provided by the invention can be used for achieving the purposes of miniaturization, high reliability, easy repair and low cost and the like, and is suitable for thin-sheet type active phased-array antennas in engineering.

Description

technical field [0001] The invention belongs to the technical field of radio frequency microwave circuits, and relates to a three-dimensional inverted T / R (transmitting and receiving) component. Background technique [0002] The circuit layout and signal interface direction of the two-dimensional T / R component are on the same plane; the three-dimensional T / R component is different from the two-dimensional T / R component. multi-layer cascading connections. The two-dimensional T / R module is a traditional solution with a simple design but low integration; the three-dimensional T / R module is developed on the basis of the two-dimensional T / R module and has a high degree of integration. The design and assembly of the key foundation of the control array antenna array are relatively complicated. [0003] Currently, there are three main design schemes for 3D T / R components. The first solution is to independently package each layer of the circuit in the three-dimensional component, ...

AI Technical Summary

Problems solved by technology

The two-dimensional T / R module is a traditional solution with a simple design but low integration; the three-dimensional T / R module is developed on the basis of the two-dimensional T / R module and has a high degree of integration. The key foundation of the control array antenna array, the design and assembly are more complicated

[0005] 1) The T / R components designed in the first scheme are individually packaged on each layer, contain many connectors or cables, are large in size and low in integration, and are difficult to meet the miniaturization requirements. When the frequency is high, the T / R components cannot be achieved. Smaller pitch requirements for planar arrays

[0006] 2) The second solution can realize the miniaturization of T / R components, but it has extremely high process requirements, low maintainability and poor reliability

When the chip in the component is damaged, the BGA pad will easily fall off when the ball is repeatedly planted

And when the BGA balls are planted and melted for many times, repeated heating will reduce the reliability of chips and circuits

[0007] 3) The T / R component designed in the third scheme can meet miniaturization and maintainability, but the assembly process is complicated and the cost is high, which is not conducive to engineering batch use, and the button is prone to burrs after repeated assembly, which reduces reliability

Images