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Manufacturing method of graphite heat sink, graphite heat sink and electronic equipment

A technology of graphite heat sink and manufacturing method, which is applied in the electronic field and can solve problems such as leakage of graphite heat sink holes and the like

Active Publication Date: 2020-05-26
LENOVO (BEIJING) LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The invention provides a method for manufacturing a graphite heat sink, a graphite heat sink and electronic equipment, which are used to solve the technical problem of hole edge leakage in graphite heat sinks in the prior art

Method used

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  • Manufacturing method of graphite heat sink, graphite heat sink and electronic equipment
  • Manufacturing method of graphite heat sink, graphite heat sink and electronic equipment
  • Manufacturing method of graphite heat sink, graphite heat sink and electronic equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0056] The embodiment of the present invention provides a graphite heat sink, as shown in Figure 1(a), Figure 1(b), and Figure 1(c), the graphite heat sink includes:

[0057] Graphite sheet 11, insulating layer 12 and inner coating 13, the insulating layer 12 is arranged on the first side of the graphite sheet 11, the graphite sheet 11 includes at least one through hole 14, the inner coating 13 covers at least part of the sidewall of the through hole.

[0058] Fig. 1 (a) is the top view of graphite heat sink, Fig. 1 (b) and Fig. 1 (c) are respectively the horizontal and vertical sectional views of graphite heat sink, in conjunction with Fig. 1 (a), Fig. 1 (b), Fig. 1 ( c) It can be seen that each through-hole on the graphite heat sink has an inner cladding layer covering part of the side wall. It is worth noting that a layer of powdered heat dissipation material and / or powdered heat insulation material may be included between the graphite sheets. In this way, the powdery heat...

Embodiment 2

[0069] Embodiments of the present invention provide a notebook computer, such as Figure 6 shown, including:

[0070] A keyboard 61; a graphite heat sink 62 attached to the bottom of the keyboard 61; a heating device 63 connected to the graphite heat sink 62;

[0071] Wherein, the graphite heat sink 62 includes: a graphite sheet, an insulating layer and an inner coating, the insulating layer is arranged on the first side of the graphite sheet, the graphite sheet includes at least one through hole, and the graphite sheet includes at least one through hole. The inner covering layer covers at least part of the sidewall of the through hole.

[0072] Optionally, the heating device 63 includes at least one of the following devices: a central processing unit, a graphics card, a hard disk, and a display.

[0073] In this way, since the graphite heat sink has the characteristics of high thermal conductivity and low thermal resistance, the heat generating device connected to it can pe...

Embodiment 3

[0085] An embodiment of the present invention provides a method for manufacturing a graphite heat sink, which is used to manufacture the graphite heat sink provided in Embodiment 1 of the present invention, such as Figure 8 shown, including:

[0086] S801, disposing an insulating layer on a first side of a graphite sheet, where the graphite sheet includes at least one through hole.

[0087] S802. Cover at least part of the sidewall of the through hole with an inner coating layer.

[0088] Optionally, the arranging the insulating layer on the first side of the graphite sheet includes: covering the through hole with the insulating layer; and covering at least part of the sidewall of the through hole with a cladding layer includes: The punching head is used to penetrate the through hole from the first side, and the inner covering layer is formed by extending the insulating layer into the through hole.

[0089] Specifically, the material of the insulating layer may be polyester...

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PUM

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Abstract

The invention discloses a graphite radiating fin, a manufacture method thereof, and electronic equipment, relates to the field of electronic technology, and aims at solving the technical problem that hole edge leakage occurs in a graphite radiating fin in the prior art. The graphite radiating fin comprises a graphite flake layer, an insulating layer and an inner coating, the insulating layer is arranged at a first side of the graphite flake layer, the graphite flake layer comprises at least one through hole, and the inner coating wraps at least part of the sidewall of the through hole.

Description

technical field [0001] The present application relates to the field of electronic technology, in particular to a method for manufacturing a graphite heat sink, a graphite heat sink and electronic equipment. Background technique [0002] Because graphite heat sinks have the advantages of high thermal conductivity, low thermal resistance, and light weight, there are currently a large number of electronic devices using graphite heat sinks for uniform heat dissipation. [0003] As electronic equipment becomes lighter and thinner, the space inside the electronic equipment becomes smaller and smaller. Therefore, in order to prevent the entire graphite heat sink from blocking the components of the electronic equipment, it is necessary to print on the graphite heat sink according to the arrangement of the components of the electronic equipment. Hole, do avoidance treatment. [0004] After the hole is punched, if the graphite heat sink is not encapsulated, the graphite flakes and ot...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20G06F1/20B32B9/00B32B33/00
Inventor 杨帆李金玉
Owner LENOVO (BEIJING) LTD