Temperature regulation using phase change materials contained in an emi can
A technology of endothermic materials and thermally conductive materials, applied in circuits, electrical components, electrical solid devices, etc., can solve the problems of no temperature regulation, lack of time delay effect, polluted electrical short circuit, etc.
Inactive Publication Date: 2017-05-24
HENKEL IP
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- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Although these solutions improve heat flow, they do not provide temperature regulation due to the lack of time delay effect
[0005] Tanks have been filled directly with phase change materials, however application and reprocessing of these materials is often difficult and can be cumbersome
Contamination and the presence of electrical shorts can also cause problems due to the presence of thermally conductive fillers
Method used
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Examples
Experimental program
Comparison scheme
Effect test
Embodiment 1
[0054] The temperature change experienced by a printed circuit board with a prior art shielding can on it was measured in the presence and absence of the added phase change material.
[0055] It was observed that the presence of the phase change material provided some temperature control of the printed circuit board.
Embodiment 2
[0057] The same protocol as in Example 1 was repeated with the shielding tank of the present invention.
[0058] It was observed that the use of phase change materials in the articles of the invention provided almost twice the temperature moderation compared to that observed in Example 1 .
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Provided herein are multicomponent shield can(s) for temporary heat storage and junction temperature regulation using a phase change material (PCM) contained therein. Invention articles can be applied to most electronic devices, especially to small portable electronic devices such as cell phones and tablets.
Description
technical field [0001] The present invention relates to a method for regulating the temperature of an EMI (Electromagnetic Interference) shielded electronic assembly, such as a printed circuit board. In another aspect, the invention relates to articles suitable for use in the methods of the invention. In yet another aspect, the invention relates to an assembly comprising an electronic component and an article of the invention. Background technique [0002] In electronic applications, in the absence of external heat sinks, most of the heat generated by electrical components is conducted into the printed circuit board where it is spread and dissipated to the surrounding environment. [0003] Shielding cans are commonly used in electronic devices to isolate electrical components on printed circuit boards from radio frequency electromagnetic radiation. Metal shielding cans are also occasionally used as heat sinks through the use of thermal interface pads in direct contact with...
Claims
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IPC IPC(8): H05K9/00H01L23/06
CPCH05K7/20454H05K7/20463H05K7/20481H05K9/0032
Inventor M·贝尔赫A·库尔卡尼D·马斯利卡
Owner HENKEL IP
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