Temperature regulation using phase change materials contained in an emi can

Abstract

Provided herein are multicomponent shield can(s) for temporary heat storage and junction temperature regulation using a phase change material (PCM) contained therein. Invention articles can be applied to most electronic devices, especially to small portable electronic devices such as cell phones and tablets.

Description

technical field [0001] The present invention relates to a method for regulating the temperature of an EMI (Electromagnetic Interference) shielded electronic assembly, such as a printed circuit board. In another aspect, the invention relates to articles suitable for use in the methods of the invention. In yet another aspect, the invention relates to an assembly comprising an electronic component and an article of the invention. Background technique [0002] In electronic applications, in the absence of external heat sinks, most of the heat generated by electrical components is conducted into the printed circuit board where it is spread and dissipated to the surrounding environment. [0003] Shielding cans are commonly used in electronic devices to isolate electrical components on printed circuit boards from radio frequency electromagnetic radiation. Metal shielding cans are also occasionally used as heat sinks through the use of thermal interface pads in direct contact with...

AI Technical Summary

Problems solved by technology

Although these solutions improve heat flow, they do not provide temperature regulation due to the lack of time delay effect

[0005] Tanks have been filled directly with phase change materials, however application and reprocessing of these materials is often difficult and can be cumbersome

Contamination and the presence of electrical shorts can also cause problems due to the presence of thermally conductive fillers

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