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Machining method for drilling of backboard of PCB

A processing method and printed circuit technology, applied in the direction of boring/drilling, metal processing equipment, drilling/drilling equipment, etc., can solve the problems of copper wire in the hole, broken drill, peaking, etc., to reduce broken drill High efficiency, not easy to break the drill, and improve the effect of heat dissipation

Inactive Publication Date: 2017-05-31
新野鼎邦实业有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the actual implementation process, due to the characteristics of back drilling itself and the technical difficulties such as circuit structure requirements, especially in the drilling process, back drilling is prone to quality problems such as copper wires in the hole, hole blocking, broken drilling, and peak peaking.

Method used

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  • Machining method for drilling of backboard of PCB
  • Machining method for drilling of backboard of PCB
  • Machining method for drilling of backboard of PCB

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Embodiment Construction

[0018] The present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0019] A method for drilling holes on a PCB printed circuit board backplane, the steps comprising:

[0020] 1) According to the thickness of the plate and the size of the hole, when drilling the through hole, select a drill with a suitable diameter and blade length. Considering that the back plate is generally processed with high thickness, small hole diameter, and relatively large thickness-to-diameter ratio, a combination of two types of micro-drills, the long flute UC type (long-edged drill) and the short flute ST type (short-edged drill), are used. The method of drilling is carried out, and the short flute ST micro-drill is used for pre-drilling, the hole depth is controlled at 10-30% of the plate thickness, and then the long chip flute micro-drill is used to complete the drilling of the entire micro-hole, not only The hole posit...

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Abstract

The invention discloses a machining method for drilling of a backboard of a PCB. During first time of drilling, drilling is conducted through a mode combining two micro drill bits of a long chip discharging groove UC-shaped (a long blade drill pin) micro drill bit and a short chip discharging groove ST-shaped (a short blade drill pin) micro drill bit; firstly, pre-drilling is conducted through the short chip discharging groove ST-shaped micro drill bit, the depth of a hole is 10-30% of the thickness of the board, and then the long chip discharging groove UC-shaped micro drill bit is used for drilling; during long chip discharging groove drilling, a mode of multi-step drilling is adopted, and if the depth the to-be-drilled hole is d, drilling is conduced according to the proportion of 1 / d:2 / d:3 / d:4 / d for each step in sequence; and during back drill drilling, a drill pin with the drill pit angle being 150-170 degrees is selected, a one-side copper-clad board is adopted, and the copper side is placed downwards and makes contact with the PCB. Compared with the prior art, a traditional back drill drilling mode adopting positive and negative drilling and using a traditional aluminum board to serve as a cover board is changed, drilling efficiency is effectively improved, positioning precision is good, and problems that machining, flashing, hole plugging, pin breaking and the like of back drill drilling are effectively solved.

Description

technical field [0001] The invention relates to the technical field of PCB circuit board processing, in particular to a method for drilling holes on a PCB printed circuit board backplane. Background technique [0002] In the production process of PCB printed circuit boards, the backplane is widely used. The backplane refers to a type of printed board with lines and many rows of jacks, which is mainly used to carry other functional sub-boards and chips, and to transmit high-speed signals and large currents. product. As a kind of high-end printing plate product with specialized nature, backplane generally has the characteristics of large size, many layers, large thickness, and high aspect ratio of aperture. It has developed rapidly in recent years and is widely used in communications, aerospace, medical equipment, and military base stations. , supercomputers and other fields. Due to the special performance of the backplane, its design parameters and some requirements that ne...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23B41/14
CPCB23B41/14
Inventor 王俊锋王雪峰谭芒飞
Owner 新野鼎邦实业有限公司
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