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Dual-module multi-track circuit substrate transmission apparatus

A circuit substrate and transmission device technology, applied in the field of dual-module multi-track circuit substrate transmission device, can solve the problems of reduced work efficiency, poor adaptability, unfavorable work rhythm, etc., to improve work efficiency, avoid collisions, and improve adaptability Effects on Sexuality and Productivity

Active Publication Date: 2017-05-31
SHANDONG RIFA TEXTILE MACHINERY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the placement head works very fast, while the moving speed of the transmission device is relatively slow, sometimes the waiting time of the placement head will be 2-3 times the working time, which seriously affects the work efficiency of the placement equipment
[0004] Second, poor adaptability
Since the traditional placement equipment is single-track, the width of the track is certain during the working process, so it can only be adapted to one specification of PCB board, which reduces the work efficiency and is not conducive to the reasonable allocation of work rhythm.

Method used

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  • Dual-module multi-track circuit substrate transmission apparatus
  • Dual-module multi-track circuit substrate transmission apparatus
  • Dual-module multi-track circuit substrate transmission apparatus

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] For the convenience of description, the coordinate system is defined as figure 1 shown.

[0040] Such as figure 1 As shown, a dual-module multi-track circuit substrate transmission device includes a bottom plate 1, and a first track mechanism 2 and a plurality of second track mechanisms 3 are sequentially arranged on the bottom plate 1 from back to front, as a specific Embodiment, the number of the second track mechanism 3 described in this embodiment is one.

[0041] Such as figure 1 , image 3 with Figure 7 As shown, the first track mechanism 2 includes a first track 21 and a second track 22 from back to front, wherein the first track 21 is arranged on the left side of the first track 21, The first fixed support 23 at the right two ends is fixedly connected with the base plate 1 . The left and right ends of the second track 22 are respectively provided with first sliding supports 24, and the first sliding supports 24 are slidably connected to the bottom plate 1...

Embodiment 2

[0059] The number of conveying motors used to drive the conveying mechanism 6 is one, and the first transmission shaft 61 and the second transmission shaft 62 are respectively provided with electromagnetic clutches. When working, different transmission shafts are controlled by the electromagnetic clutches. All the other structures are the same as in Embodiment 1.

Embodiment 3

[0061] The number of the width-adjusting motor used to drive the width-adjusting mechanism 7 is one, and the first lead screw 71, the second lead screw and the third lead screw 73 on the side connected to the width-adjustment motor are respectively provided with electromagnetic clutches , When working, the width of the track is adjusted by controlling the electromagnetic clutch to make different lead screws work. All the other structures are the same as in Embodiment 1.

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Abstract

The invention discloses a dual-module multi-track circuit substrate transmission apparatus comprising a base plate. The base plate is provided with a first track mechanism and a plurality of second track mechanisms, wherein the first track mechanism has a first track and a second track; the first track is fixedly connected with the base plate via a first fixing bearer; the second track is slideably connected with the base plate via a first sliding bearer; each second track mechanism comprises a third track and a fourth track; the third and fourth tracks are respectively slideably connected with the base plate via a second sliding bearer and a third sliding bearer; the left and right ends of the first and second track mechanisms are respectively provided with a carrying mechanism in the same structure and arranged in a symmetric way; and the first and second track mechanisms are further provided with a width adjusting mechanism adjusting the width of the track. Time for a head mounting device is saved, so the head mounting device can be at a work state all the time; and therefore work pace can be arranged and planned, and work efficiency can be improved.

Description

technical field [0001] The invention relates to the technical field of surface mounting of electronic components, in particular to a dual-module multi-track circuit substrate transmission device. Background technique [0002] Most of the existing electronic component mounting equipment is single-module single-track or double-module single-track, and there are the following problems in the use of this mounting equipment. [0003] First, the work efficiency is low. Whether it is a single-module or a double-module placement equipment, since there is only one track, after the placement head completes the placement of a certain station on the PCB board, it must wait for the completed PCB board to be sent out. The mounted PCB board is sent in, and the placement head is in a non-working state during this process. Since the placement head works very fast, while the moving speed of the transmission device is relatively slow, sometimes the waiting time of the placement head will be ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B65G47/52B65G47/74
CPCB65G47/52B65G47/74
Inventor 任保胜宋长杰祁玉斌
Owner SHANDONG RIFA TEXTILE MACHINERY