Unlock instant, AI-driven research and patent intelligence for your innovation.

LED chip package structure realizing super high dense display inverted structure

A technology of LED chip and packaging structure, applied in electrical components, circuits, semiconductor devices, etc., can solve the problems of inability to solder welding reliability, small-pitch LED package size reduction, etc.

Inactive Publication Date: 2017-05-31
SUZHOU KINGLIGHT OPTOELECTRONICS CO LTD
View PDF5 Cites 5 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Welding and bonding wires have requirements for the distance between the electrode of the chip and the pad of the BT board. If the distance is too small, it will cause problems such as inability to solder or low soldering reliability, thus restricting the reduction of the package size of small-pitch LEDs.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • LED chip package structure realizing super high dense display inverted structure
  • LED chip package structure realizing super high dense display inverted structure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0018] Such as figure 1 and figure 2 As shown, a flip-chip LED chip packaging structure for ultra-high-density display, including a substrate 1, a blue LED chip 2, a green LED chip 3, a red LED chip 4, a bonding wire 5, and an independent negative pad 6 , B independent negative electrode pad 7, common positive electrode pad 8 and triangular structure green paint 9; the blue LED chip 2 and the green LED chip 3 are flip-chip structure chips, and the red light LED chip 4 is a vertical structure chip, The front and back of the substrate 1 are respectively provided with front circuit lines 11 and back circuit lines, and the substrate 1 is provided with conductive holes 10 for connecting the front circuit lines 11 and the back circuit lines, the The conductive hole 10 extends from the front circuit line 11 to the back circuit line, and it is filled and sealed with a conductive metal substance or a non-conductive substance. A common positive electrode is arranged on the front circu...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

An LED chip package structure realizing a super high dense display inverted structure comprises a base plate, a blue light LED chip, a green light LED chip and a red light LED chip. The obverse side and the reverse side of the base plate are each provided with an obverse circuit and a revere circuit, a conducting hole is arranged on the base plate, and a public anodic welding pad, an A independent cathodic welding pad and a B independent cathodic welding pad are arranged on the obverse circuit of the base plate. The blue light LED chip is connected with the A independent cathodic welding pad and the public anodic welding pad through a conductive foundation adhesive. The green light LED chip is connected with the B independent cathodic welding pad and the public anodic welding pad through a conductive foundation adhesive. The red light LED chip is fixedly connected with the public anodic welding pad through a conductive foundation adhesive. A surface electrode of the red light LED chip is connected to the obverse circuit through a bonding wire. The middle portion of the reverse face of the base plate is provided with triangle-structured green paint. The size of the LED package structure is greatly reduced and super high dense display LED full color application is realized.

Description

technical field [0001] The invention relates to the technical field of LED packaging, in particular to a flip-chip LED chip packaging structure for realizing ultra-high-density display. Background technique [0002] With the continuous improvement of indoor display application technology, the technology of traditional display products has gradually reached the top, and indoor small-pitch products will become the main space for technology development in the future; in order to replace LCD and DLP indoor high-definition display products, LED packaging structures for small-pitch displays The size needs to be smaller to reduce the pixel distance of the display screen and realize high-definition display function. The traditional small-pitch LED packaging structure adopts a chip design with two electrodes on the surface. During the LED packaging process, two bonding wires are required to connect the two electrodes to the pads of the BT board to achieve conduction. Soldering and b...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/62
CPCH01L33/48H01L33/62
Inventor 龚文邵鹏睿
Owner SUZHOU KINGLIGHT OPTOELECTRONICS CO LTD