Vertical-structure LED chip packaging structure for realizing super-high density display
A LED chip and vertical structure technology, applied in semiconductor devices, electrical components, circuits, etc., can solve the problems of small-pitch LED package size reduction, inability to solder and solder reliability, etc.
Pending Publication Date: 2017-05-24
SUZHOU KINGLIGHT OPTOELECTRONICS CO LTD
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Problems solved by technology
Wire bonding has requirements for the distance between the electrode of the chip and the pad of the BT board. If the distance is too small, it will cause problems such as inability to weld or low welding reliability, thus restricting the reduction of the package size of small-pitch LEDs.
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[0018] Such as figure 1 with figure 2 As shown, a vertical LED chip packaging structure for ultra-high density display, including substrate 1, blue LED chip 2, green LED chip 3, red LED chip 4, bonding wire 5, A independent pad 6, B Independent pad 7, C independent pad 8, public pad 9 and green paint 10 with a triangular structure; the blue LED chip 2, the green LED chip 3 and the red LED chip 4 are chips with a vertical structure, and the substrate The front side and the back side of 1 are respectively provided with a front side circuit line and a back side circuit line, and a conductive hole 11 for connecting the front side circuit line and the back side circuit line is provided on the substrate 1, and the conductive hole 11 is formed from the The front circuit line extends to the back circuit line, and it is filled and sealed with a conductive metal substance or a non-conductive substance. A common pad 9 is arranged on the front circuit line of the substrate 1 and placed ...
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The invention discloses a vertical-structure LED chip packaging structure for realizing super-high density display, which comprises a substrate, a blue light LED chip, a green light LED chip, a red light LED chip, bonding lines, an A independent welding pad, a B independent welding pad, a C independent welding pad, a common welding pad and triangular structure green paint, wherein the blue light LED chip, the green light LED chip and the red light LED chip are chips of vertical structures, the front surface of the substrate is provided with a front surface circuit line, the back surface of the substrate is provided with a back surface circuit line, conductive holes are formed in the substrate, the front surface circuit line of the substrate is provided with the common welding pad, the A independent welding pad, the B independent welding pad and the C independent welding pad, the three LED chips are connected to the three independent welding pads separately by means of conductive base glue, surface electrodes of the three LED chips are each connected onto the common welding pad by means of one bonding line, and the middle part of the back surface of the substrate is provided with the triangular structure green paint. The vertical-structure LED chip packaging structure greatly reduces the size of the LED packaging structure, and realizes super-high density display LED full-color application.
Description
technical field [0001] The invention relates to the technical field of LED packaging, in particular to a vertical structure LED chip packaging structure for realizing ultra-high-density display. Background technique [0002] With the continuous improvement of indoor display application technology, the technology of traditional display products has gradually reached the top, and indoor small-pitch products will become the main space for technology development in the future; in order to replace LCD and DLP indoor high-definition display products, LED packaging structures for small-pitch displays The size needs to be smaller to reduce the pixel distance of the display screen and realize high-definition display function. The traditional small-pitch LED packaging structure adopts a chip design with two electrodes on the surface. During the LED packaging process, two bonding wires are required to connect the two electrodes to the pads of the BT board to achieve conduction. Wire b...
Claims
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IPC IPC(8): H01L25/075H01L33/62H01L33/54
CPCH01L25/0753H01L33/54H01L33/62H01L2224/49113
Inventor 龚文邵鹏睿
Owner SUZHOU KINGLIGHT OPTOELECTRONICS CO LTD