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Laser processing machine and method for making numerical control program

A technology of laser processing machine and numerical control program, which is applied in the direction of program control, digital control, electrical program control, etc., and can solve problems such as time-consuming

Inactive Publication Date: 2018-08-03
MITSUBISHI ELECTRIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the nozzle collides with the workpiece, the machining head needs to move away from the workpiece temporarily and then approach the workpiece again, so the approaching action will take time

Method used

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  • Laser processing machine and method for making numerical control program
  • Laser processing machine and method for making numerical control program
  • Laser processing machine and method for making numerical control program

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Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0039] figure 1 It is a block diagram of the laser processing machine concerning Embodiment 1 of this invention. The laser processing machine 100 has a numerical control unit 10, a sensor data processing unit 18, a distance sensor 19, an X servo control unit 20, a Y servo control unit 21, a Z servo control unit 22, an X servo motor 23, a Y servo motor 24, and a Z servo motor. 25 and laser oscillator 26. The numerical control unit 10 has a main control unit 13 , a processing machine control unit 14 , a position control unit 15 , and a height control unit 17 .

[0040] The main control unit 13 controls the overall operation of the laser processing machine 100 . The processing machine control unit 14 sends a command to the laser oscillator 26 to control the generation / stop of laser light. The position control unit 15 and the height control unit 17 output position commands in the XYZ axis directions to the X servo control unit 20 , the Y servo control unit 21 , and the Z servo ...

Embodiment approach 2

[0082] The device configuration of the laser processing machine according to the second embodiment of the present invention is the same as that of the first embodiment. In Embodiment 2, when the approach operation is performed at the non-peripheral portion of the workpiece 12, the height control unit 17 uses the first approach speed and the first gain, which are parameters for the approach operation at the non-peripheral portion of the workpiece 12, to When the approach operation is performed at the peripheral portion of the workpiece 12 , the height control unit 17 uses the second approach speed and the first gain which are parameters for the approach operation at the peripheral portion of the workpiece 12 . That is, the height control unit 17 uses the first gain regardless of whether the approach operation is at the peripheral portion of the workpiece 12 or at the non-peripheral portion of the workpiece 12 . In addition, the second approach speed is a value smaller than the ...

Embodiment approach 3

[0095] Figure 13 It is a block diagram of the laser processing machine concerning Embodiment 3 of this invention. The same reference numerals are assigned to the same parts as those in Embodiment 1, and description thereof will be omitted. Compared with the laser processing machine 100 of Embodiment 1, the laser processing machine 110 according to Embodiment 3 further includes a processed area storage unit 29 .

[0096] In Embodiment 3, when performing an approach operation on the processed area indicated by the processed area information stored in the processed area storage unit 29, the height control unit 17 uses the second approach speed and the second approach speed, which are parameters for the peripheral portion. 2 gain for approaching actions.

[0097] The processed region is a region subjected to laser processing for cutting out a part, and is a rectangular-shaped region including a region in which the shape of the part is enlarged in the XY direction. Figure 14 i...

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PUM

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Abstract

A laser machining apparatus includes a height controller that performs an approach operation. The height controller uses a first approach speed and a first gain when performing the approach operation in a non-peripheral-edge portion of the workpiece, and uses a second approach speed lower than the first approach speed and a second gain lower than the first gain when performing the approach operation in a peripheral edge portion of the workpiece, and to make the time required when the approach operation is performed in the non-peripheral-edge portion of the workpiece shorter than the time required when the approach operation is performed in the peripheral edge portion of the workpiece.

Description

technical field [0001] The invention relates to a laser processing machine and numerical control program making software. Background technique [0002] Currently, in a laser processing device that cuts a plurality of products by laser processing a workpiece as a plate-shaped workpiece, each time the laser processing of one product is completed, the processing head is moved to the processing position of the next product and sequentially processed. Perform laser processing. [0003] The operation of bringing the machining head moved to the machining position closer to the workpiece is called approaching operation. During the proximity operation, the machining head is positioned at the first distance from the nozzle to the workpiece by monitoring the electrostatic profiling voltage that changes according to the distance between the nozzle and the workpiece installed on the machining head . [0004] During the approaching operation, if the processing head approaches the workp...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K26/38
CPCB23K26/03B23K26/048B23K26/0884B23K26/0892B23K26/38B23K2101/18G05B19/29G05B19/406G05B19/416G05B2219/36199G05B2219/50049
Inventor 高田浩子
Owner MITSUBISHI ELECTRIC CORP