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Transparent conductive wiring and method for producing transparent conductive wiring

A technology of transparent conduction and wiring, which is applied in the direction of cable/conductor manufacturing, semiconductor/solid-state device manufacturing, chemical instruments and methods, etc. It can solve the problem of large amount of overetching of metal films, inability to fully ensure electrical conductivity, and variation of overetching of metal films. Large and other problems, to achieve the effect of ensuring electrical conductivity, excellent visual transmittance, and suppressing the amount of overetching

Active Publication Date: 2018-04-20
MITSUBISHI MATERIALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0014] Here, when the film thickness of the metal film is made thin, there is a problem that the metal film is etched preferentially to the transparent conductive oxide film in the above-mentioned conventional etching method, and the amount of overetching of the metal film becomes large.
[0015] In particular, in recent years, the width of the wiring has become smaller due to the miniaturization of the wiring. Therefore, if the amount of overetching of the metal film is large, it may not be possible to ensure sufficient conductivity.

Method used

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  • Transparent conductive wiring and method for producing transparent conductive wiring
  • Transparent conductive wiring and method for producing transparent conductive wiring
  • Transparent conductive wiring and method for producing transparent conductive wiring

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0101] A laminated film having a configuration (three-layer structure of a transparent conductive oxide film, an Ag film, and a transparent conductive oxide film) shown in Table 1 was produced as follows.

[0102] When forming the Ag film, sputtering targets having compositions corresponding to the Ag film shown in Table 1 were prepared. In addition, the target size was made into diameter phi: 4 inches x thickness t: 6 mm.

[0103] In addition, the following transparent conductive oxide sputtering targets were used for the transparent conductive oxide film.

[0104] ITO: an oxide sintered body target of In and Sn containing 10 atomic % of Sn relative to the sum of In and Sn.

[0105] IZO: An oxide sintered body target of In and Zn containing 30 atomic % of Zn relative to the sum of In and Zn.

[0106] ZTO: an oxide sintered body target of Zn and Sn containing 50 atomic % of Sn relative to the sum of Zn and Sn.

[0107] AZO: an oxide sintered target of Zn and Al containing 2...

Embodiment 2

[0137] Next, transparent conductive wirings having the structure shown in Table 2 (three-layer structure of transparent conductive oxide film, Ag film, and transparent conductive oxide film) were produced by the same method as in Example 1, Nos. 1 to 7. .

[0138] About the obtained transparent conductive wiring, the possibility of etching using an oxalic-acid etchant was evaluated. In addition, after optical microscope observation and SEM observation were performed on the transparent conductive wiring after etching, the case where no residue was confirmed and the amount of overetching was 1 μm or less was evaluated as "A", and the case where etching was possible but was observed by optical microscope observation and SEM observation was evaluated as "A". As a result of the results, the case where etching residue was confirmed was evaluated as "B", and the case where the three layers (transparent conductive oxide film, Ag film, transparent conductive oxide film) could not be et...

Embodiment 3

[0146] Next, transparent conductive wirings having the structure shown in Table 3 (three-layer structure of transparent conductive oxide film, Ag film, and transparent conductive oxide film) were produced by the same method as in Example 1, Nos. 1 to 7. .

[0147] About the obtained transparent conductive wiring, the possibility of etching using an oxalic-acid etchant was evaluated. The evaluation content is the same as in Example 2. Table 3 shows the evaluation results.

[0148] [table 3]

[0149]

[0150]In the case of using an aqueous oxalic acid solution as an etching solution, it was confirmed that in No. 92 in which a crystalline ITO film was formed as a transparent conductive oxide film, compared with No. 91 in which an amorphous ITO film was formed, the Aqueous oxalic acid has poor etchability. In addition, when a mixed solution of an aqueous oxalic acid solution and nitric acid was used as an etching solution, even in No. 93 in which a crystalline ITO film was ...

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Abstract

The transparent conductive wiring (10) has an Ag film (11) made of Ag or Ag alloy and a transparent conductive oxide film (12) stacked on the Ag film (11), and a wiring pattern is formed by etching. , in the transparent conductive wiring (10), the film thickness (ta) of the Ag film (11) is in the range below 15nm, the amount of overetching of the Ag film (11) relative to the transparent conductive oxide film (12) ( L) is 1 μm or less.

Description

technical field [0001] The present invention relates to, for example, a transparent conductive wire used in a display, a touch panel, and the like, and a method for producing the transparent conductive wire. [0002] This application claims based on patent application No. 2015-37950 filed in Japan on February 27, 2015, patent application No. 2015-217683 filed in Japan on November 5, 2015, and patent application filed in Japan on February 25, 2016 2016-34768, and its contents are hereby incorporated. Background technique [0003] For example, in liquid crystal displays, organic EL displays, touch panels, and the like, as wirings, for example, as shown in Patent Documents 1 to 3, a transparent conductive wiring having a laminated structure of a transparent conductive oxide film and a metal film is applied. Wire. [0004] In this transparent conductive wiring, the transmittance of light in the visible light region (hereinafter, referred to as visual transmittance) is required...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/3213B32B9/00B32B15/04C23C14/06H01B5/14H01B13/00H01L21/306H01L21/768H05K3/06
CPCH01B1/02H01B5/14H01L21/306H01L21/3213H01L21/768
Inventor 盐野一郎岁森悠人野中庄平斋藤淳
Owner MITSUBISHI MATERIALS CORP