Double-mass-block tuning fork angular rate gyroscope with structure decoupling capacity

An angular rate gyro and dual-mass technology, which is applied in gyroscope/steering sensing equipment, gyro effect for speed measurement, instruments and other directions, can solve the difficulty of vertical torsion bar processing and other problems, and achieve the suppression of Z-direction interference mode, The effect of reducing the influence and reducing the quadrature error

Pending Publication Date: 2017-06-09
NANJING UNIV OF SCI & TECH
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Problems solved by technology

However, in the bulk silicon process, it is quite difficult to process the vertical torsion bar

Method used

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  • Double-mass-block tuning fork angular rate gyroscope with structure decoupling capacity
  • Double-mass-block tuning fork angular rate gyroscope with structure decoupling capacity
  • Double-mass-block tuning fork angular rate gyroscope with structure decoupling capacity

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Embodiment Construction

[0017] The present invention will be described in further detail below in conjunction with the accompanying drawings.

[0018] combine Figure 1 to Figure 3 , a dual-mass tuning fork angular rate gyroscope with structural decoupling capability, used to measure the angular rate in the Z-axis direction. It includes an upper vacuum packaging cover plate, a lower silicon substrate and a middle single crystal silicon chip, and a gyro mechanical structure is arranged on the middle layer single crystal silicon chip. The present invention adopts wafer-level vacuum encapsulation technology, the upper vacuum encapsulation cover plate, the middle single crystal silicon wafer and the lower silicon substrate are made of silicon material, and a closed vacuum cavity is formed between the upper vacuum encapsulation cover plate and the lower silicon substrate , the middle single crystal silicon wafer is arranged in the vacuum cavity, so that the mechanical structure of the gyroscope is suspen...

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Abstract

The invention discloses a double-mass-block tuning fork angular rate gyroscope with structure decoupling capacity. The gyroscope comprises an upper vacuum packaging cover plate, a lower silicon substrate and a middle monocrystalline silicon wafer, wherein a gyroscope mechanical structure is arranged on the middle monocrystalline silicon wafer; two substructures of the gyroscope mechanical structure are symmetrically distributed both sides of a mass block connecting mechanism and two truss / horizontal-straight-beam combined mechanisms; and a first U-shaped beam is arranged along the long side of each substructure, the truss / horizontal-straight-beam combined mechanisms are connected with the substructures through the first U-shaped beams, and the straight beam is arranged in the width direction of the substructure, and used for connecting the first U-shaped beams on both sides of the substructure. The gyroscope implements motion decoupling in the drive mode and detection mode, lowers the output quadrature error, implements the drive mode and detection mode as the first-order mode and second-order mode, effectively inhibits the drive same-direction mode, detection same-direction mode, Z-direction mode and other common interference modes, and has the advantages of favorable gyroscopic properties, high consistency and high vibration interference resistance.

Description

technical field [0001] The invention belongs to micro-electro-mechanical systems and micro-inertia measurement technology, in particular to a double-mass tuning fork angular rate gyroscope with structure decoupling capability. Background technique [0002] Micromachined inertial instruments include micromachined gyroscopes (MMG) and micromachined accelerometers (MMA). The use of microelectronic processing technology allows the complete integration of micromechanical structures and required electronic circuits on a silicon chip, thereby achieving a high degree of unity in terms of performance, price, volume, weight, and reliability. Therefore, this type of instrument has a series of advantages (such as small size, light weight, cheap price, high reliability, mass production, etc.), and has broad application prospects in both military and civilian fields. In civilian use, it is mainly used in the automotive industry, industrial monitoring and consumer products and robotics, s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01C19/5621
CPCG01C19/5621
Inventor 杨海波苏岩吴志强杨明明
Owner NANJING UNIV OF SCI & TECH
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