Upper conductive layer of grid substrate
A conductive layer and substrate technology, applied in the layout details of conductive patterns, printed circuits and electrical components connected to non-printed electrical components, etc., can solve problems such as material waste, and achieve the effect of low technical requirements and material saving
Pending Publication Date: 2017-06-09
XIHUA UNIV
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- Application Information
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Problems solved by technology
[0004] The main purpose of the present invention is to overcome the disadvantages of large material waste in the production process of the network substrate and the upper conductive layer proposed by CN105263259A in the prior art, and provide a printed circuit board with a new structure of the upper conductive layer of the network substrate
Method used
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[0015] In order to further explain the technical means and effects of the present invention to achieve the intended purpose of the invention, the specific implementation, structure, Features and their functions are described in detail below.
[0016] like figure 1 It is a schematic plan view of the upper conductive layer of a grid substrate proposed by a preferred embodiment of the present invention. The upper conductive layer (1) of the grid substrate to be fabricated is 30 cm long, 21 cm wide, and 0.2 mm thick, with 117 hollows of 1.7 * 1.7 cm hole (11). The upper frame conductive sheet (2), the right frame conductive sheet (3), the lower frame conductive sheet (4) and the left frame conductive sheet (5) are manufactured by using the flexible copper clad laminate. Insert the limiting protrusion (21) of the upper frame conductive sheet (2) into the limiting groove (22) of the left frame conductive sheet (5), and then insert the limiting protrusion (21) of the right frame co...
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Abstract
The invention relates to an upper conductive layer of a grid substrate, including conductive sheets (hereinafter referred to as an upper frame conductive sheet, a bottom frame conductive sheet, a left frame conductive sheet, a right frame conductive sheet, a horizontal conductive sheet, and a vertical conductive sheet). The upper conductive layer can be manufactured by using a CCL (Copper Clad Laminate) or a FCCL (Flexible Copper Clad Laminate) via a printed circuit board manufacturing process and also can be manufactured by a thin metal film by a cutting process. The conductive sheets are provided with spacing grooves and / or spacing protrusion objects used for inter-conductive sheet cooperation, location and connection, so as to form the complete upper conductive layer. The upper conductive layer is advantaged by being low in cost and saving materials.
Description
technical field [0001] The invention relates to a printed circuit board, in particular to a printed circuit board with a net as the base. Background technique [0002] In the prior art, CN105263259A proposes the concept of network substrate and upper conductive layer, and the upper conductive layer is made of copper clad laminate (CCL Copper Clad Laminate) or flexible copper clad laminate (FCCL Flexible Copper Clad Laminate) through printed circuit board manufacturing process, The part where no wiring and components are not placed on it is cut off, and because the area occupied by the circuit pattern is very small, 60%-80% of the copper clad laminate or flexible copper clad laminate is wasted. [0003] In order to reduce the material waste of copper clad laminates or flexible copper clad laminates, at the same time take advantage of the advantages of high precision and accurate location of chemical corrosion. The designer finally creates the present invention with practical...
Claims
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Patent Timeline
Login to View More IPC IPC(8): H05K1/02H05K1/18
CPCH05K1/0296H05K1/18H05K2201/1031
Inventor 靳斌靳丰泽尚小华
Owner XIHUA UNIV