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A diode feeding device

A diode and diode technology, which is applied in the field of diode feeding devices, can solve problems such as hidden safety hazards of components and hot spots of components, and achieve the effect of high degree of automation and ingenious and reasonable structure.

Active Publication Date: 2018-04-10
WUXI LEAD INTELLIGENT EQUIP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, with the continuous improvement of battery efficiency, the output power of battery modules is getting higher and higher, and the problem of module hot spots is becoming more and more serious, because hot spots not only have a great impact on the actual output power of modules, but also have Certain potential safety hazards, so the suppression of component hot spots is particularly important

Method used

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  • A diode feeding device
  • A diode feeding device
  • A diode feeding device

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Embodiment Construction

[0019] The present invention will be further described below in conjunction with specific examples.

[0020] Defined in this embodiment: with figure 2 Right is front, with figure 2 The left side is back, the vertical paper is outward, and vice versa is inner

[0021] The form of the strip of the diode is roughly as figure 1 As shown in , it mainly includes a membrane 400 , a diode 401 , and a bottom case 402 . The bottom case 402 is provided with a recess for placing the diode 401 , and a small hole 403 is provided on the side of each diode. The film 400 covers the top of the bottom case 402 , and the film 400 seals the diode 401 .

[0022] A secondary tube feeding device, comprising a first support plate 105, the first support plate 105 is vertically arranged and fixed to the frame, and the first support plate 105 is provided with a driving mechanism for driving the forward transmission of the material belt , the sheet suction table 104 and the second guide shaft 1062, ...

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PUM

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Abstract

The invention relates to a diode material loading device. A material belt is unreeled through a material disc arranged beside a first support plate, the first support plate is provided with a driving mechanism used for driving the material belt to convey forwards, the driving mechanism comprises a first rotary shaft, a second rotary shaft and a third rotary shaft, the material belt penetrates through the first rotary shaft and the second rotary, the material belt conducts material loading forwards by being pressed through the first rotary shaft and the second rotary, rollers used for conveying film and a bottom case respectively are arranged in front of the driving mechanism, and both the bottom case and the uncovered film pass between the second rotary shaft and the third rotary shaft after penetrating through space between the rollers and conduct material unloading by being pressed through the second rotary shaft and the third rotary shaft; an uncovered film rear material belt passes through a piece-suction table, a piece-suction component is arranged above the piece-suction table, the piece-suction component is fixed to a moving mechanism, and the moving mechanism can drive the piece-suction component to move between the piece-suction component and a piece placing position. The diode material loading device is ingenious and reasonable in structure and high in degree of automation, and can fast take out a diode in the material belt and convey the diode to a welding station.

Description

technical field [0001] The invention belongs to the field of automation equipment, and in particular relates to a diode feeding device in the manufacturing process of solar cell components. Background technique [0002] The development of photovoltaic technology promotes the continuous growth of industries related to solar cells, and the demand for solar equipment is also increasing. However, with the continuous improvement of battery efficiency, the output power of battery modules is getting higher and higher, and the problem of module hot spots is becoming more and more serious, because hot spots not only have a great impact on the actual output power of modules, but also have Certain potential safety hazards, so the suppression of component hot spots is particularly important. [0003] In order to reduce the influence of module hot spots, solder diodes are added between the positive and negative electrode strips of each cell, which can effectively reduce its impact on mo...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L31/18
CPCH01L31/1876Y02P70/50
Inventor 姜勇朱杰
Owner WUXI LEAD INTELLIGENT EQUIP CO LTD