Multi-segment through-hole porous dental implant

A dental implant, multi-stage technology, applied in the fields of dental implants, dentistry, dental repair, etc., can solve the problems of poor bonding strength, slow bonding speed, and difficult to achieve porous structure, so as to improve the bonding strength and success rate , to avoid the effect of stress shielding effect

Active Publication Date: 2022-06-17
ZHEJIANG UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] In order to overcome the shortcomings of existing dental implants such as poor bonding strength, slow bonding speed, and difficulty in realizing a porous structure, the present invention provides a multi-stage through-hole porous structure that effectively improves the bonding strength, increases the bonding speed, and is easy to realize a porous structure. dental implant

Method used

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  • Multi-segment through-hole porous dental implant
  • Multi-segment through-hole porous dental implant
  • Multi-segment through-hole porous dental implant

Examples

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Embodiment Construction

[0031] The present invention will be further described below in conjunction with the accompanying drawings.

[0032] refer to Figure 1 to Figure 5 , a multi-segment through-hole porous dental implant, comprising a gingival section and a threaded section, the gingival section is a smooth solid structure, the gingival section is located on the upper part of the threaded section, and the dental implant also includes a porous structure The porous structure section is located at the lower part of the thread section. In the porous structure section, porous structures with increasing pore diameters are used in sequence from bottom to top; The through holes are radial, and each lateral through hole is distributed along the circumference.

[0033] Further, the lateral through holes of one aperture and the lateral through holes of adjacent upper and lower apertures are arranged in a dislocation.

[0034] Or: the lateral through holes of one aperture and the lateral through holes of a...

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Abstract

A multi-segment through-hole porous dental implant, comprising a gingival section and a threaded section, the gingival section is a smooth solid structure, the gingival section is located on the upper part of the threaded section, and the dental implant also includes a porous structure section , the porous structure section is located at the bottom of the threaded section, and in the porous structure section, a porous structure with an increasing pore diameter is adopted sequentially from bottom to top; The holes are radial, and the individual transverse through-holes are distributed along the circumference. The invention provides a multi-segment through-hole porous dental implant that can effectively improve the bonding strength, increase the bonding speed, and easily realize the porous structure.

Description

technical field [0001] The invention relates to the technical field of dental implant restoration, in particular to a multi-section through-hole porous dental implant. Background technique [0002] Missing teeth will bring inconvenience to people's lives, and the restoration of dentures has been unable to meet people's needs. In recent years, the development of dental implant technology has successfully solved this problem for us. Dental implants are artificial teeth made from natural teeth. It is mainly divided into two parts: the crown that bears the chewing force and the implant that is screwed into the mandible. The success of dental implants is largely determined by the implants. A successful dental implant should allow the implant to form a complete osseointegration with the mandible with good biocompatibility. In order to promote the combination of implants and alveolar bone, dental implants with rough surfaces have been widely used. Animal experiments and clinica...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): A61C8/00
CPCA61C8/0039A61C8/0042A61C8/0074A61C2204/00
Inventor 姚春燕张伟程康杰张威任腾玺彭伟
Owner ZHEJIANG UNIV OF TECH
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