Test motherboard usable for various chip packaging forms and test method

A technology of chip packaging and form, applied in the direction of electronic circuit testing, measuring electricity, measuring devices, etc., to achieve the effect of shortening the development time

Pending Publication Date: 2017-06-20
SHANDONG SENSPIL ELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Because there are various types and models of various chips on the market, as well as packaging forms a

Method used

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  • Test motherboard usable for various chip packaging forms and test method
  • Test motherboard usable for various chip packaging forms and test method

Examples

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Example Embodiment

[0023] The present invention will be further described below in conjunction with the drawings and embodiments:

[0024] This test mother board is mainly used as a conversion bridge between the test machine and the test daughter board. The test mother board connects the FPGA with the test machine through a fixed interface, and at the same time, the FPGA expands multiple digital signal ports and passes through the high-speed socket (first The high-speed socket and the second high-speed socket) are connected to the test daughter board. By configuring the internal logic conversion of the FPGA, the test machine can test different functions of different chips.

[0025] Such as figure 1 As shown, a test motherboard that can be used in multiple chip packaging forms includes a programmable chip (an FPGA chip is used as an example in this embodiment), and the FPGA chip reserves an interface for connecting with a test machine; the FPGA The chip is connected with the configuration chip and a f...

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Abstract

The invention discloses a test motherboard which can be used in various chip packaging forms, including a programmable chip, the programmable chip is reserved with an interface connected with a test machine; the programmable chip is connected with a configuration chip and a first The high-speed socket is connected, and the first high-speed socket is connected with at least one second high-speed socket; the second high-speed socket is connected with an analog signal test point. The invention can realize the compatibility test design of various chips and test machines, greatly shorten the test board development time required for testing chips, and can realize the measurement of digital logic and analog signals at the same time, and the test motherboard can also be reused. While reducing the development board investment, it also reduces maintenance costs.

Description

technical field [0001] The invention relates to the field of chip packaging and testing, in particular to a testing motherboard and a testing method that can be used in various chip packaging forms. Background technique [0002] In the process of chip packaging and testing, the completion of chip testing is a necessary link to ensure chip production and packaging yield. Because there are various types and models of various chips on the market, as well as packaging forms and pins, if a test board is redesigned for each chip, it will take a lot of manpower and material resources. Contents of the invention [0003] The purpose of the present invention is to solve the above problems, providing a test motherboard that can be used in various chip packaging forms, which can reduce the investment of packaging and testing manufacturers in testing boards, and greatly improve the packaging and testing process of newly imported chips. [0004] In order to achieve the above object, th...

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Application Information

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IPC IPC(8): G01R31/28
CPCG01R31/2806
Inventor 刘昭麟邢广军林朝征
Owner SHANDONG SENSPIL ELECTRONICS TECH
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