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Test motherboard usable for various chip packaging forms and test method

A technology of chip packaging and form, applied in the direction of electronic circuit testing, measuring electricity, measuring devices, etc., to achieve the effect of shortening the development time

Pending Publication Date: 2017-06-20
SHANDONG SENSPIL ELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Because there are various types and models of various chips on the market, as well as packaging forms and pins, it will take a lot of manpower and material resources to redesign the test board for each chip.

Method used

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  • Test motherboard usable for various chip packaging forms and test method
  • Test motherboard usable for various chip packaging forms and test method

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Embodiment Construction

[0023] Below in conjunction with accompanying drawing and embodiment the present invention will be further described:

[0024] This test motherboard is mainly used as a conversion bridge between the test machine and the test sub-board. The test motherboard connects the FPGA to the test machine through a fixed interface. The high-speed socket and the second high-speed socket) are connected to the test sub-board, and by configuring FPGA internal logic conversion, the test machine can test different functions of different chips.

[0025] Such as figure 1 As shown, a kind of test mother board that can be used for multiple chip package forms, comprises programmable chip (the present embodiment takes FPGA chip as example), and described FPGA chip is reserved the interface that is connected with test machine; Said FPGA The chip is connected with the configuration chip and the first high-speed socket, and the first high-speed socket is connected with three second high-speed sockets; ...

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Abstract

The invention discloses a test motherboard usable for various chip packaging forms. The test motherboard comprises a programmable chip. A port connected with a test machine bench is reserved in the programmable chip. The programmable chip is connected with a configuration chip and a first high speed socket. The first high speed socket is connected with at least one second high speed socket which is connected with a simulation signal test point. According to the invention, compatibility test design of all kinds of chip to the test machine bench can be achieved; test board development time required for testing the chip is greatly reduced; measurement of digital logic and simulation signals can be achieved simultaneously; the motherboard is reusable; investment on development of the board is reduced; and maintenance cost is also reduced.

Description

technical field [0001] The invention relates to the field of chip packaging and testing, in particular to a testing motherboard and a testing method that can be used in various chip packaging forms. Background technique [0002] In the process of chip packaging and testing, the completion of chip testing is a necessary link to ensure chip production and packaging yield. Because there are various types and models of various chips on the market, as well as packaging forms and pins, if a test board is redesigned for each chip, it will take a lot of manpower and material resources. Contents of the invention [0003] The purpose of the present invention is to solve the above problems, providing a test motherboard that can be used in various chip packaging forms, which can reduce the investment of packaging and testing manufacturers in testing boards, and greatly improve the packaging and testing process of newly imported chips. [0004] In order to achieve the above object, th...

Claims

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Application Information

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IPC IPC(8): G01R31/28
CPCG01R31/2806
Inventor 刘昭麟邢广军林朝征
Owner SHANDONG SENSPIL ELECTRONICS TECH
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